Low profile attachment method for pluggable optical modules
The present disclosure relates to a module for use in a network element comprising of a circuit board and a cage mounted on the circuit board where the cage is configured to support a pluggable optical module. The circuit board including a mounted block and a riding heatsink disposed over the cage and connected to the mounting block via a low profile spring clip. The riding heatsink includes a main body and side flanges having a height less than the main body, wherein the low profile spring clip connects to the side flanges. The riding heatsink includes a plurality of fins for dissipation of heat via airflow thereover, and low-profile spring clip has a height that does not obstruct any openings between the plurality of fins.
1 . A module for use in a network element, the module comprising:
a circuit board;
a cage mounted on the circuit board, wherein the cage is configured to support a pluggable optical module;
a mounting block fastened directly to the circuit board beside the cage; and
a riding heatsink including a main body, a side flange extending outwards from the main body and downwards from the main body beside the cage, the side flange being disposed outside of and below an upper surface of the cage, and a plurality of fins extending from the main body for dissipation of heat via airflow therethrough disposed over the cage and connected to the mounting block via a low profile spring clip, wherein the side flanges has a height less than the main body, wherein the low profile spring clip connects to the side flange below a height of the main body, and wherein neither the mounting block nor the low profile spring clip block the airflow into any openings between the plurality of fins.
2 . The module of claim 1 , wherein the low profile spring clip has a height that does not block the airflow into any of the openings between the plurality of fins.
3 . The module of claim 2 , wherein the airflow is side to side, such that the low profile spring clip is located on at least one side of the riding heatsink and is oriented perpendicular to the airflow.
4 . The module of claim 1 , wherein the low profile spring clip connects to the side flange via a screw having a height less than the main body.
5 . The module of claim 1 , wherein the airflow is front to back.
6 . The module of claim 5 , wherein the low profile spring clip is located on at least one side of the riding heatsink and is oriented parallel to the airflow.
7 . The module of claim 5 , wherein the low profile spring clip is located on the at least one side of the riding heatsink such that the low profile spring clip does not block the airflow into any of the openings between the plurality of fins.
8 . The module of claim 1 , wherein the low profile spring clip includes a length spanning a portion of the riding heatsink and is configured to apply pressure to the riding heatsink.
9 . The module of claim 1 , wherein the pluggable optical module is one of a C form factor pluggable (CFP), a CFP2, a CFP4, and a CFP8.
10 . The module of claim 1 , wherein the pluggable optical module is an octal small form factor pluggable (OSFP).
11 . The module of claim 1 , wherein the mounting block is separate from the cage, such that attachment of the riding heat sink to the circuit board is independent of the cage.
12 . A method comprising providing a module for use in a network element, the module including
a circuit board;
a cage mounted on the circuit board, wherein the cage is configured to support a pluggable optical module;
a mounting block fastened directly to the circuit board beside the cage; and
a riding heatsink including a main body, a side flange extending outwards from the main body and downwards from the main body beside the cage, the side flange being disposed outside of and below an upper surface of the cage, and a plurality of fins extending from the main body for dissipation of heat via airflow therethrough disposed over the cage and connected to the mounting block via a low profile spring clip, wherein the side flanges has a height less than the main body, wherein the low profile spring clip connects to the side flange below a height of the main body, and wherein neither the mounting block nor the low profile spring clip block the airflow into any openings between the plurality of fins.
13 . The method of claim 12 , wherein the low profile spring clip has a height that does not block the airflow into any of the openings between the plurality of fins.
14 . The method of claim 12 , wherein the airflow is front to back.
15 . The method of claim 12 , wherein the low-profile spring clip includes a length spanning a portion of the riding heatsink and is configured to apply pressure to the riding heatsink.