IP Library › Granted Patent US 12,660,391
Granted Patent B2
US 12,660,391 · App. 18/139,691 · Granted Jun 16, 2026

Display module having contact protrusions

Inventors: Changkyu Chung (Suwon-si, KR); Sungyong Min (Suwon-si, KR); Kyungwoon Jang (Suwon-si, KR); Kwangrae Jo (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H10H20/857H10H20/819H10W90/00H10H20/0364
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Quick Facts
Patent No.
US 12,660,391
App. No.
18/139,691
Granted
Jun 16, 2026
Kind
B2
Abstract

A display module includes a substrate, a plurality of substrate electrode pads provided on the substrate, and a plurality of micro light-emitting diodes (LEDs) connected to the plurality of substrate electrode pads, where each of the plurality of substrate electrode pads includes a first region in which a plurality of contact protrusions are formed, and a second region configured to be connected with a repair micro LED.

Claims (28)

1 . A display module comprising:

a substrate;

a plurality of substrate electrode pads provided on the substrate; and

a plurality of micro light-emitting diodes (LEDs) connected to the plurality of substrate electrode pads,

wherein each of the plurality of substrate electrode pads comprises:

a first region in which a plurality of contact protrusions are formed, and

a second region configured to be connected to a repair micro LED,

wherein the display module further comprises a capping layer provided on and covering each substrate electrode pad of the plurality of substrate electrode pads and configured to prevent oxidation of the plurality of substrate electrode pads, and

wherein each of the plurality of substrate electrode pads cover respective pluralities of contact protrusions in respective first regions.

2 . The display module of claim 1 , wherein the plurality of substrate electrode pads comprises at least four substrate electrode pads, and

wherein the at least four substrate electrode pads comprise:

a first substrate electrode pad, a second substrate electrode pad, and a third substrate electrode pad that are connected to a power electrode; and

a fourth substrate electrode pad connected to a common electrode.

3 . The display module of claim 2 , wherein the first region of the fourth substrate electrode pad and the second region of the fourth substrate electrode pad are alternatingly arranged.

4 . The display module of claim 1 , wherein each of the plurality of micro LEDs comprises a pair of LED electrode pads, and

wherein each micro LED of the plurality of micro LEDs respectively corresponds to a pair of substrate electrode pads of the plurality of substrate electrode pads.

5 . The display module of claim 1 , wherein the plurality of contact protrusions are evenly distributed inside the first region.

6 . The display module of claim 1 , wherein an elastic core is provided on inner sides of the plurality of contact protrusions.

7 . The display module of claim 6 , wherein the elastic core comprises a conductive material or a non-conductive material.

8 . The display module of claim 1 , wherein the plurality of contact protrusions have hemisphere shapes, tetrahedrons, circular columns, or oval column shapes.

9 . The display module of claim 1 , wherein the plurality of contact protrusions have rectilinear shapes with a specific length, and

wherein the plurality of contact protrusions are arranged in parallel at a predetermined interval.

10 . The display module of claim 1 , wherein the plurality of substrate electrode pads comprises at least one of Ti/Al/Ti, Mo/Al/Mo, Cu/Ni/Au, Ni, Cu, or Indium.

11 . The display module of claim 1 ,

wherein the capping layer comprises at least one of Au, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or Indium.

12 . The display module of claim 1 , wherein a surface of the second region comprises a plane.

13 . The display module of claim 1 , wherein a pair of chip electrode pads is respectively connected to a pair of corresponding substrate electrode pads, and

wherein each chip electrode pad comprises at least one of Ni/Au, Ti/Au, or Cu(Ni) Pillar/SnAg Bump.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2023
From: CHUNG, CHANGKYU; MIN, SUNGYONG; JANG, KYUNGWOON; JO, KWANGRAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063451/0334 →
Priority Claims (1)
KR 10-2020-0165031 · Nov 30, 2020 · national
Continuity (2)
Continuation PCTKR2021001394 · Feb 3, 2021
Related Publication 20230290919A1 · Sep 14, 2023
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