Display device
A display device according to an embodiment of the present disclosure, the hole is disposed in the inorganic insulating layer in the region overlapping the outer peripheral line of the flexible film or the region adjacent to the outer peripheral line of the flexible film, which makes it possible to suppress the propagation of cracks caused by an air gap in the pad area and improve the reliability of the display device.
1 . A display device, comprising:
a substrate having a plurality of subpixels in a display area and a non-display area disposed adjacent to the display area;
a pad area in the non-display area;
a link area disposed between the display area and the pad area;
a first inorganic insulating layer disposed on the substrate in the link area;
a plurality of pad electrodes disposed in the pad area;
a plurality of link lines disposed in the link area and overlying the first inorganic insulating layer, the plurality of link lines being configured to respectively electrically connect the plurality of pad electrodes and the plurality of subpixels;
an organic insulating layer disposed on the plurality of link lines and on the first inorganic insulating layer;
a first hole disposed in the first inorganic insulating layer, the hole located to overlap a portion of at least one link line of the plurality of link lines; and
a gate insulating layer disposed above the first inorganic insulating layer and below a gate link line disposed in the first hole
wherein:
the organic insulating layer is positioned in and fills the first hole;
a top surface and a side surface of the gate link line disposed in the first hole adjoin the organic insulating laver; and
a bottom surface of the gate link line disposed in the first hole adjoins the gate insulating layer.
2 . The display device of claim 1 , further comprising:
a flexible film disposed on the plurality of pad electrodes and electrically connected to the plurality of pad electrodes,
wherein the first hole overlaps an edge of an outer peripheral line of the flexible film.
3 . The display device of claim 2 , wherein the first hole overlaps the outer peripheral line adjacent to the link area among the outer peripheral lines of the flexible film.
4 . The display device of claim 2 , wherein the first hole is disposed between the display area and the outer peripheral line adjacent to the link area among the outer peripheral lines of the flexible film.
5 . The display device of claim 1 , further comprising:
a second hole disposed adjacent to an outer peripheral line of the substrate disposed in the pad area.
6 . The display device of claim 1 , wherein;
the plurality of link lines includes at least one of a data link line; and
each of the plurality of link lines are electrically connected to a pad electrode through a conductive layer disposed in the pad area.
7 . The display device of claim 5 , further comprising:
a second inorganic insulating layer disposed on the plurality of link lines, wherein:
the gate link line is disposed in the second hole; and
the second hole is disposed in the second inorganic insulating layer.
8 . The display device of claim 7 , further comprising:
a conductive layer configured to electrically connect the gate link line and a pad electrode,
wherein the conductive layer is disposed below the first inorganic insulating layer.
9 . The display device of claim 1 , wherein the plurality of link lines is disposed on the organic insulating layer, and the first hole is disposed below the plurality of link lines.
10 . The display device of claim 1 , further comprising:
a conductive layer configured to electrically connect the plurality of link lines and at least one pad electrode,
wherein the conductive layer is disposed above the first inorganic insulating layer.
11 . A display device, comprising:
a substrate having a display area and a non-display area disposed adjacent to the display area;
a plurality of pixels in the display area;
a first insulating layer on the substrate;
a pad area in the non-display area;
a plurality of pad electrodes disposed in the pad area;
a link area located between the display area and the pad area;
a plurality of insulating layers positioned on the first insulating layer in the link area;
a plurality of conductive lines disposed in the link area and positioned on the plurality of insulating layers, the conductive lines being configured to electrically connect the plurality of pad electrodes to the plurality of subpixels, respectively;
an second insulating layer overlying the plurality of conductive lines in the link area;
a hole disposed in the plurality of insulating layers and the second insulating layer, the hole located to overlap at least one of the conductive lines;
an organic insulating layer filling the hole and enclosing the at least one conductive line, and
a flexible film disposed on the plurality of pad electrodes and electrically connected to the plurality of pad electrodes, the flexible film being located to overlap the hole in the plurality of insulating layers, the second insulating layer and the organic insulating layer filling the hole.
12 . The display device of claim 11 , wherein the organic insulating layer filling the hole is in direct physical contact with the at least one conductive line on the top and two sides thereof.
13 . The display device of claim 12 , wherein the organic insulating layer filling the hole is in direct physical contact with the at least one conductive line on the bottom thereof.
14 . A method of making the display device of claim 11 , the method comprising:
forming the display area on the substrate, the display area including a pixel area having a plurality of light emitting pixels therein;
forming the non-display area on the substrate adjacent to the pixel area, the non-display area including the link area and the pad area;
depositing the first insulating layer on the substrate, the first insulating layer being disposed into both the display area and the non-display area;
depositing the plurality of insulating layers on the first insulating layer, the plurality of insulating layers being disposed in the link area;
forming a conductive pad in the pad area;
depositing a conductive link line on the plurality of insulating layers, the conductive link line extending from the pad area, through the link area and into the display area;
depositing the second insulating layer overlying the conductive link line in the pad area and in the link area;
forming the hole extending through the second insulating layer and the plurality of insulating layers in the link area, the conductive link line not being removed and being exposed within the hole after the hole is formed; and
filling the hole with the organic insulating layer that encloses the conductive link line within the hole on at least three sides thereof.
15 . The method of claim 14 , wherein the step of forming the hole in the link area includes:
removing the second insulating layer and the plurality of insulating layers with an etch process that does not remove the conductive link line or the first insulating layer.
16 . The method of claim 15 , wherein the conductive link line is suspended in the hole after the hole is formed and before the organic insulating layer fills the hole.
17 . The method of claim 14 , wherein the organic conductive layer is in direct contact with at least three surfaces of the conductive link line and at least one layer of the plurality of conductive layers is in contact with the conductive link line when the conductive link line is enclosed by the organic conductive layer.