Semiconductor device and method of manufacturing semiconductor device
A semiconductor device includes a wiring board, a first semiconductor chip provided on the wiring board upwards, the first semiconductor chip including a first front surface having a connection terminal electrically connected to the wiring board and a second front surface opposite the first front surface, a chip stacked body provided on the wiring board upwards, the chip stacked body including a second semiconductor chip, a sealing insulator configured to cover the first semiconductor chip and the chip stacked body, the sealing insulator containing a resin, and a heat conductor provided between the sealing insulator and the second front surface and including a first region extending in a first direction which is an in-plane direction of the wiring board and a second region extending in a second direction from an end of the first region on a side of the first direction when a direction perpendicular to the in-plane direction of the wiring board and the first direction is defined as the second direction, the heat conductor having heat conductivity higher than heat conductivity of the resin.
1 . A semiconductor device comprising:
a wiring board;
a first semiconductor chip disposed on the wiring board extending upwards, the first semiconductor chip including a first front surface and a second front surface, the first front surface having a connection terminal electrically connected to the wiring board, and the second front surface opposite the first front surface, the first front surface is a bottom surface of the first semiconductor chip and the second front surface is a top surface of the first semiconductor chip;
a chip stacked body disposed on the wiring board extending upwards, the chip stacked body including a second semiconductor chip;
a sealing insulator configured to cover the first semiconductor chip and the chip stacked body, the sealing insulator containing a resin; and
a heat conductor disposed between the sealing insulator and the second front surface, the heat conductor including a first region extending in a first direction and in contact with the first front surface, the first direction being in an in-plane direction of the wiring board, the heat conductor including a second region extending in a second direction from an end of the first region on a side of the first direction,
wherein a direction perpendicular to the in-plane direction of the wiring board and the first direction is defined as the second direction, the heat conductor having a heat conductivity higher than a heat conductivity of the resin.
2 . The semiconductor device according to claim 1 , wherein (i) a first end surface of the first region facing the side of the first direction, and (ii) a second end surface of the second region facing the side of the first direction, are exposed from the sealing insulator.
3 . The semiconductor device according to claim 1 , wherein the heat conductor further includes a third region provided at an end of the second region on a side of the second direction, and the third region is different from the second region.
4 . The semiconductor device according to claim 3 , wherein a third end surface of the third region facing the side of the second direction is exposed from the sealing insulator.
5 . The semiconductor device according to claim 1 , wherein the chip stacked body is disposed on the first semiconductor chip extending upwards, and
wherein the heat conductor is spaced apart from the chip stacked body.
6 . The semiconductor device according to claim 1 , wherein the heat conductor has (i) an oxide front surface in contact with the sealing insulator or (ii) an uneven front surface in contact with the sealing insulator.
7 . The semiconductor device according to claim 1 , further comprising a first heat insulating material disposed on a side surface of the first semiconductor chip, the first heat insulating material having a heat conductivity lower than the heat conductivity of the resin.
8 . The semiconductor device according to claim 5 , further comprising a second heat insulating material disposed between the heat conductor and the chip stacked body, the second heat insulating material having a heat conductivity lower than the heat conductivity of the resin.
9 . The semiconductor device according to claim 1 , wherein the wiring board includes a printed wiring board.
10 . The semiconductor device according to claim 1 , wherein the first semiconductor chip includes a memory controller chip.
11 . The semiconductor device according to claim 10 , wherein the second semiconductor chip includes a memory chip.
12 . The semiconductor device according to claim 1 , wherein the heat conductor includes a metal material.
13 . The semiconductor device according to claim 1 , wherein the first region includes a lower plate.
14 . The semiconductor device according to claim 13 , wherein the second region includes a side plate.
15 . The semiconductor device according to claim 14 wherein the lower plate overlaps the side plate.
16 . The semiconductor device according to claim 1 , further comprising an underfill resin disposed between the first semiconductor chip and the wiring board.
17 . A semiconductor device comprising:
a wiring board;
a first semiconductor chip disposed on the wiring board extending upwards, the first semiconductor chip including a first front surface and a second front surface, the first front surface having a connection terminal electrically connected to the wiring board, and the second front surface opposite the first front surface;
a chip stacked body disposed on the wiring board extending upwards, the chip stacked body including a second semiconductor chip;
a sealing insulator configured to cover the first semiconductor chip and the chip stacked body, the sealing insulator containing a resin; and
a heat conductor disposed between the sealing insulator and the second front surface, the heat conductor including a first region extending in a first direction, the first direction being in an in-plane direction of the wiring board, the heat conductor including a second region extending in a second direction from an end of the first region on a side of the first direction, the heat conductor including a third region provided at an end of the second region on a side of the second direction,
wherein a direction perpendicular to the in-plane direction of the wiring board and the first direction is defined as the second direction, the heat conductor having a heat conductivity higher than a heat conductivity of the resin,
a third end surface of the third region facing the side of the second direction is exposed from the sealing insulator.