Flexible and stretchable structures
Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
1 . An apparatus, comprising:
a substrate layer;
a metal layer coupled to the substrate layer, wherein the metal layer comprises a metal foil;
an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions; and
at least one via extending through the substrate layer coupling the metal foil to a pattern of traces formed on a surface of the substrate opposite the metal foil, wherein the via and the pattern of traces comprise a fluid phase conductor.
2 . The apparatus of claim 1 , wherein the substrate layer is comprised of at least one of: a B-stage resin, a C-stage resin, and a stretchable adhesive film.
3 . The apparatus of claim 2 , wherein the stretchable adhesive film is a stretchable thermoplastic adhesive film.
4 . The apparatus of claim 1 , wherein the encapsulant is comprised of a stretchable film.
5 . The apparatus of claim 4 , wherein the stretchable film is comprised of at least one of: an elastomer, a B-stage thermosetting film, a C-stage thermosetting film, and a thermosetting resin.
6 . The apparatus of claim 1 , wherein the metal layer is comprised of copper.
7 . The apparatus of claim 6 , wherein the copper is oxygen-free copper.
8 . The apparatus of claim 1 , wherein the metal layer is comprised of metal foil.
9 . The apparatus of claim 8 , wherein the metal foil is etched to form a plurality of conductive traces.
10 . The apparatus of claim 1 , wherein the metal layer forms a plurality of conductive traces.
11 . The apparatus of claim 10 , further comprising:
an electronic component; and
a via extending through the substrate layer electrically coupling the electronic component to at least one of the conductive traces.
12 . The apparatus of claim 11 , wherein the electronic component is secured to the substrate layer.
13 . The apparatus of claim 12 , wherein the stencil-in-place structure is secured to one of the substrate layer or the encapsulant.
14 . The apparatus of claim 1 , wherein the encapsulant is comprised of a B-stage resin.
15 . The apparatus of claim 1 , wherein the metal layer forms a ground plane.
16 . The apparatus of claim 1 , wherein the substrate layer is comprised of an adhesive configured to secure the metal layer to the substrate layer.
17 . The apparatus of claim 1 , further comprising a textile secured to at least one of the encapsulant or the substrate layer.
18 . An apparatus comprising:
a substrate layer;
a metal layer coupled to the substrate layer;
an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions; and
a stencil-in-place structure, comprising a stencil substrate layer and conductive gel secured within a channel and a via formed by the stencil substrate layer, the conductive gel electrically coupled to the metal layer.
19 . An apparatus, comprising:
a substrate layer;
a metal layer coupled to the substrate layer; and
an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions;
an electronic component coupled to at least one of the metal layer and the encapsulant;
a stencil-in-place structure, comprising a stencil substrate layer and conductive gel secured within a channel and a via formed by the stencil substrate layer, the conductive gel electrically coupled to the metal layer.
20 . The apparatus of claim 19 , wherein the electronic component is electrically coupled to the metal layer with conductive gel.
21 . The apparatus of claim 20 , wherein the electronic component is mechanically coupled to the metal layer with a via in electrical contact with the conductive gel.
22 . The apparatus of claim 19 , wherein the electronic component is electrically coupled to the metal layer with solder.
23 . The apparatus of claim 22 , wherein the electronic component is mechanically coupled to the metal layer with the solder.