Heat dissipation member
Provided is a heat dissipation member according to the present invention that includes a flat metal-silicon carbide composite containing aluminum, the heat dissipation member including: at least one through hole that penetrates the flat metal-silicon carbide composite in a plate thickness direction; a tapered portion where an inner diameter of the through hole gradually increases toward an outer side in a periphery of one or both end portions of the through hole; a metal portion containing aluminum that is formed on an inner surface of the through hole; and a screw hole that is formed in the metal portion.
1 . A heat dissipation member that includes a flat metal-silicon carbide composite containing aluminum, the heat dissipation member comprising:
at least one through hole that penetrates the flat metal-silicon carbide composite in a plate thickness direction;
a tapered portion where an inner diameter of the through hole gradually increases toward an outer side in a periphery of one or both end portions of the through hole;
a metal portion containing aluminum that is formed on an inner surface of the through hole; and
a screw hole that is formed in the metal portion;
wherein an angle of the tapered portion is equal to or more than 0.2° and equal to or less than 7°.
2 . The heat dissipation member according to claim 1 ,
wherein when a maximum hole diameter of the through hole is represented by D 1 and a hole diameter of the screw hole is represented by D 2 , D 2 /D 1 satisfies equal to or more than 0.1 and equal to or less than 0.9.
3 . The heat dissipation member according to claim 1 , further comprising:
a plating layer that is formed on a surface of the metal portion in the screw hole.
4 . The heat dissipation member according to claim 3 ,
wherein in a cross-sectional view of the through hole, when a thickness of the metal portion is represented by W 1 and a thickness of the plating layer in the screw hole is represented by W 2 , W 2 /W 1 satisfies equal to or more than 0.001 and equal to or less than 0.04.
5 . The heat dissipation member according to claim 1 , further comprising:
a plating layer that is formed on a main surface side of the heat dissipation member.
6 . The heat dissipation member according to claim 5 ,
wherein the plating layer is formed of a Ni plating layer containing Ni element.
7 . The heat dissipation member according to claim 1 , further comprising:
a metal layer that is provided on a main surface of the heat dissipation member and contains aluminum.
8 . The heat dissipation member according claim 1 ,
wherein an average thermal expansion coefficient of the heat dissipation member at 25° C. to 150° C. is equal to or more than 4 ppm/K and equal to or less than 12 ppm/K.
9 . The heat dissipation member according to claim 1 ,
wherein a thermal conductivity of the heat dissipation member in a plate thickness direction at 25° C. is equal to or more than 150 W/m·K and equal to or less than 300 W/m·K.