IP Library › Granted Patent US 12,717,749
Granted Patent B2
US 12,717,749 · App. 18/818,543 · Granted Aug 25, 2026

Systems, methods, and apparatus for processing in memory using die-to-die interconnects

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Quick Facts
Patent No.
US 12,717,749
App. No.
18/818,543
Filed
Aug 28, 2024
Granted
Aug 25, 2026
Kind
B2
Art Unit
2184
USPC
710/306
Continuity (2)
Provisional Application 63608823 · Dec 11, 2023
Related Publication 20250190391A1 · Jun 12, 2025
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