Granted Patent
B2
US 12,719,028 · App. 18/298,551 · Granted Aug 25, 2026
Substrate processing device
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Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Apr 18, 2023
From: SON, HYOUNGKYU; SIM, JAEWOONG; KIM, DONGUK; KIM, YUNSANG; KIM, INHOE
To: SEMES CO., LTD.
Reel/Frame 063358/0123 →
Priority Claims (1)
KR 10-2022-0059725
· May 16, 2022
· national
Continuity (1)
References Cited (17)
US 6036878A
· Collins
· 2000
[cited by examiner]
US 20100243620A1
· Yamawaku
· 2010
[cited by examiner]
CN 1737991A
· 2006
[cited by examiner]
JP H06196443A
· 1994
[cited by applicant]
JP 6452449B2
· 2019
[cited by applicant]
KR 1020170076572A
· 2017
[cited by applicant]
KR 1020170095983A
· 2017
[cited by applicant]
KR 1020180125091A
· 2018
[cited by applicant]
KR 102039969B1
· 2019
[cited by applicant]
KR 1020210016848A
· 2021
[cited by applicant]
Korean Notice of Allowance dated Oct. 17, 2024 issued in corresponding Korean Appln. No. 10-2022-0059725.
[cited by applicant]
Korean Office Action dated Feb. 13, 2024 issued in corresponding Korean Appln. No. 10-2022-0059725.
[cited by applicant]