IP Library › Granted Patent US 12,720,821
Granted Patent B2
US 12,720,821 · App. 18/322,611 · Granted Aug 25, 2026

Semiconductor device and manufacturing method thereof

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Quick Facts
Patent No.
US 12,720,821
App. No.
18/322,611
Granted
Aug 25, 2026
Kind
B2
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2023
From: WANG, PEI-YU; HUANG, WANG-CHUN; CHUNG, CHENG-TING; LIAO, YI-BO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063757/0431 →
Continuity (1)
Related Publication 20240395861A1 · Nov 28, 2024
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