IP Library › Granted Patent US 12,721,143
Granted Patent B2
US 12,721,143 · App. 18/066,464 · Granted Aug 25, 2026

Hybrid method for forming semiconductor interconnect structure

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,721,143
App. No.
18/066,464
Filed
Dec 15, 2022
Granted
Aug 25, 2026
Kind
B2
Art Unit
2899
USPC
257/288
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2022
From: FU, SHIH-KANG; LEE, MING-HAN; SHUE, SHAU-LIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
Reel/Frame 062102/0281 →
Continuity (3)
Continuation 17873590 · Jul 26, 2022
Division 16837762 · Apr 1, 2020
Related Publication 20230118565A1 · Apr 20, 2023
References Cited (23)
US 6124192A · Jeng · 2000 [cited by examiner]
US 8772109B2 · Colinge · 2014 [cited by applicant]
US 8785285B2 · Tsai et al. · 2014 [cited by applicant]
US 8816444B2 · Wann et al. · 2014 [cited by applicant]
US 8823065B2 · Wang et al. · 2014 [cited by applicant]
US 8860148B2 · Hu et al. · 2014 [cited by applicant]
US 9105490B2 · Wang · 2015 [cited by examiner]
US 9236267B2 · De et al. · 2016 [cited by applicant]
US 9236300B2 · Liaw · 2016 [cited by applicant]
US 9520482B1 · Chang et al. · 2016 [cited by applicant]
US 9576814B2 · Wu et al. · 2017 [cited by applicant]
US 20070205482A1 · Yang · 2007 [cited by examiner]
US 20100321095A1 · Mikawa · 2010 [cited by examiner]
US 20110220861A1 · Himeno · 2011 [cited by examiner]
US 20120104350A1 · Himeno · 2012 [cited by examiner]
US 20130299968A1 · Lin · 2013 [cited by examiner]
US 20160013133A1 · Gu · 2016 [cited by examiner]
US 20160190322A1 · Liu · 2016 [cited by examiner]
US 20180076133A1 · Bonilla · 2018 [cited by examiner]
US 20180164698A1 · Yang · 2018 [cited by examiner]
US 20180190809A1 · Huang · 2018 [cited by examiner]
US 20190326214A1 · Lin · 2019 [cited by examiner]
US 20200279745A1 · Cheng · 2020 [cited by examiner]