IP Library › Granted Patent US 12,721,168
Granted Patent B2
US 12,721,168 · App. 17/814,949 · Granted Aug 25, 2026

Direct substrate-side cooling in power device module

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Quick Facts
Patent No.
US 12,721,168
App. No.
17/814,949
Filed
Jul 26, 2022
Granted
Aug 25, 2026
Kind
B2
Art Unit
2893
USPC
257/326
Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 061879, FRAME 0655 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →
SECURITY INTEREST Recorded Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2022
From: PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; YAO, YUSHUANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060623/0875 →
Continuity (1)
Related Publication 20240038632A1 · Feb 1, 2024
References Cited (8)
US 20070057248A1 · Yao et al. · 2007 [cited by applicant]
US 20090057882A1 · Gerbsch · 2009 [cited by applicant]
US 20100230800A1 · Beaupre · 2010 [cited by examiner]
US 20130020694A1 · Liang · 2013 [cited by examiner]
US 20140185243A1 · Joo · 2014 [cited by examiner]
US 20200176354A1 · Matsuzawa · 2020 [cited by examiner]
US 20200388557A1 · Yoo · 2020 [cited by examiner]
US 20230395464A1 · Du · 2023 [cited by examiner]