IP Library › Granted Patent US 12,721,242
Granted Patent B2
US 12,721,242 · App. 18/183,699 · Granted Aug 25, 2026

Semiconductor package and method of manufacturing the same

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Quick Facts
Patent No.
US 12,721,242
App. No.
18/183,699
Filed
Mar 14, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2899
USPC
257/737
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2023
From: HWANG, HYEONJEONG; KIM, DONGWOOK; SUK, KYOUNGLIM; SONG, INHYUNG; JANG, SEHOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062980/0130 →
Priority Claims (1)
KR 10-2022-0097910 · Aug 5, 2022 · national
Continuity (1)
Related Publication 20240047324A1 · Feb 8, 2024
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