Resin composition and product made therefrom
A resin composition is provided, which comprises: 100 parts by weight of resin A including vinyl group-containing polyphenylene ether resin or maleimide resin; 5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1); and 2 parts by weight to 15 parts by weight of a compound B including a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4). Also, a product made from the aforesaid resin composition is provided, including a resin-coated copper, a laminate or a printed circuit board.
1 . A resin composition, comprising:
100 parts by weight of resin A, comprising vinyl group-containing polyphenylene ether resin or maleimide resin;
5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1); and
2 parts by weight to 15 parts by weight of a compound B, comprising a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4);
wherein
in Formula (1), m is an integer of 2 to 18;
in Formula (3), each of a 1 , a 2 and a 3 is independently an integer of 0 to 7;
in Formula (4), each of b1, b2, b3 and b4 is independently an integer of 0 to 9.
2 . The resin composition of claim 1 , wherein the compound having the structure represented by Formula (3) comprises a compound having a structure represented by Formula (3-1):
3 . The resin composition of claim 1 , wherein the compound having the structure represented by Formula (4) comprises a compound having a structure represented by Formula (4-1):
4 . The resin composition of claim 1 , further comprising 5 parts by weight to 20 parts by weight of resin C, wherein the resin C comprises polyolefin resin, epoxy-containing acrylate resin, polyvinyl butyral resin, polyimide resin or phenoxy resin.
5 . The resin composition of claim 1 , further comprising inorganic filler, silane coupling agent, inhibitor, flame retardant, coloring agent, toughening agent, core-shell rubber or solvent.
6 . A product made from the resin composition of claim 1 , comprising a resin-coated copper, a laminate or a printed circuit board.
7 . The product of claim 6 , having at least one of the following properties:
a resin flow rate of copper-clad laminate as measured by reference to IPC-TM-650 2.3.17 of less than or equal to 10.0%;
a X-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 30 ppm/° C.; and
a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 4.5 lb/in.