Granted Patent B2

US 12,724,469 · App. 18/603,276 · Granted Sep 1, 2026

Inventors: Haoyi Ye (Shanghai, CN); Jianhong Zeng (Shanghai, CN); Xiaoni Xin (Shanghai, CN)

Assignee: Delta Electronic (Shanghai) CO., LTD.

G06F1/189H02M3/02H02M3/1584

Abstract

Claims (70)

1 . A system of providing power to a chip on a mainboard, comprising:

a first power supply assembly, located on the mainboard, wherein the first power supply assembly is configured to receive a first voltage and to provide a second voltage;

a second power supply assembly and a third power supply assembly, wherein the second power supply assembly and the third power supply assembly are located on the mainboard and disposed at different sides of the chip, each of the second power supply assembly and the third power supply assembly is electrically connected to the first power supply assembly to receive the second voltage, the second power supply assembly provides a third voltage to the chip, the third power supply assembly provides a fourth voltage to the chip; and

at least one power supply assembly controller, located on the mainboard, and configured to control operation of the second power supply assembly and the third power supply assembly.

2 . The system according to claim 1 , wherein

each of the second power supply assembly and the third power supply assembly corresponds to a power supply assembly controller of the at least one power supply assembly controller, and power supply assembly controllers of the second power supply assembly and the third power supply assembly communicate with each other, so as to control the operation of the second power supply assembly and the third power supply assembly respectively.

3 . The system according to claim 1 , wherein

each of the second power supply assembly and the third power supply assembly corresponds to a power supply assembly controller of the at least one power supply assembly controller, the power supply assembly controller of the second power supply assembly is configured to independently control the operation of the second power supply assembly, the power supply assembly controller of the third power supply assembly is configured to independently control the operation of the third power supply assembly, and power supply assembly controllers of the second power supply assembly and the third power supply assembly do not communicate with each other.

4 . The system according to claim 1 , wherein

a dynamic response speed of the second power supply assembly is greater than a dynamic response speed of the third power supply assembly; and

output power of the second power supply assembly in response to a load dynamic change of the chip is greater than output power of the third power supply assembly in response to the load dynamic change of the chip.

5 . The system according to claim 1 , wherein

output impedance of the second power supply assembly is smaller than output impedance of the third power supply assembly; and

a dynamic current provided by the second power supply assembly is greater than a dynamic current provided by the third power supply assembly.

6 . A system of providing power to a chip on a mainboard, comprising:

a first power module, located on the mainboard, wherein the first power module is configured to receive a first voltage and to provide a second voltage;

a second power module and a third power module, wherein the second power module and the third power module are located on the mainboard and disposed at different sides of the chip, each of the second power module and the third power module is electrically connected to the first power module to receive the second voltage, the second power module provides a third voltage to the chip, the third power module provides a fourth voltage to the chip; and

at least one power module controller, located on the mainboard, and configured to control operation of the second power module and the third power module.

7 . The system according to claim 6 , wherein

each of the second power module and the third power module corresponds to a power module controller of the at least one power module controller, and power module controllers of the second power module and the third power module communicate with each other, so as to control the operation of the second power module and the third power module respectively.

8 . The system according to claim 6 , wherein

each of the second power module and the third power module corresponds to a power module controller of the at least one power module controller, the power module controller of the second power module is configured to independently control the operation of the second power module, the power module controller of the third power module is configured to independently control the operation of the third power module, and power module controllers of the second power module and the third power module do not communicate with each other.

9 . The system according to claim 6 , wherein each of the second power module and the third power module corresponds to a power module controller of the at least one power module controller, the power module controller of the second power module is within the second power module, and the power module controller of the third power module is within the third power module.

10 . The system according to claim 6 , wherein

a dynamic response speed of each of the second power module and the third power module is greater than a dynamic response speed of the first power module.

11 . The system according to claim 6 , wherein

a dynamic response speed of the second power module is greater than a dynamic response speed of the third power module; and

output power of the second power module in response to a load dynamic change of the chip is greater than output power of the third power module in response to the load dynamic change of the chip.

12 . The system according to claim 6 , wherein

output impedance of the second power module is smaller than output impedance of the third power module; and

a dynamic current provided by the second power module is greater than a dynamic current provided by the third power module.

13 . The system according to claim 6 , wherein

the chip is a multicore chip, comprising a first core and a second core; and

the second power module provides the third voltage to the first core, and the third power module provides the fourth voltage to the second core.

14 . A system of providing power to a chip on a mainboard, comprising:

a first power module and a second power module, wherein the first power module and the second power module are located on the mainboard, each of the first power module and the second power module is configured to receive a first voltage, the first power module provides a second voltage, and the second power module provides a third voltage;

a third power module and a fourth power module, wherein the third power module and the fourth power module are located on the mainboard, the third power module is electrically connected to the first power module to receive the second voltage, the fourth power module is electrically connected to the second power module to receive the third voltage, the third power module and the first power module are disposed at a first side of the chip, the fourth power module and the second power module are disposed at a second side of the chip, the third power module provides a fourth voltage to the chip, the fourth power module provides a fifth voltage to the chip; and

at least one power module controller, located on the mainboard, and configured to control operation of the third power module and the fourth power module.

15 . The system according to claim 14 , wherein

each of the third power module and the fourth power module corresponds to a power module controller of the at least one power module controller, and power module controllers of the third power module and the fourth power module communicate with each other, so as to control the operation of the third power module and the fourth power module respectively.

16 . The system according to claim 14 , wherein

each of the third power module and the fourth power module corresponds to a power module controller of the at least one power module controller, the power module controller of the third power module is configured to independently control the operation of the third power module, the power module controller of the fourth power module is configured to independently control the operation of the fourth power module, and power module controllers of the third power module and the fourth power module do not communicate with each other.

17 . The system according to claim 14 , wherein

each of the third power module and the fourth power module corresponds to a power module controller of the at least one power module controller, the power module controller of the third power module is within the third power module, and the power module controller of the fourth power module is within the fourth power module.

18 . The system according to claim 14 , wherein

a dynamic response speed of the third power module is greater than a dynamic response speed of the first power module; and

a dynamic response speed of the fourth power module is greater than a dynamic response speed of the second power module.

19 . The system according to claim 14 , wherein

a dynamic response speed of the third power module is greater than a dynamic response speed of the fourth power module; and

output power of the third power module in response to a load dynamic change of the chip is greater than output power of the fourth power module in response to the load dynamic change of the chip.

20 . The system according to claim 14 , wherein

output impedance of the third power module is smaller than output impedance of the fourth power module; and

a dynamic current provided by the third power module is greater than a dynamic current provided by the fourth power module.

21 . The system according to claim 14 , wherein

the chip is a multicore chip, comprising at least a first core and a second core; and

the third power module provides the fourth voltage to the first core, and the fourth power module provides the fifth voltage to the second core.

22 . A system of providing power to a chip on a mainboard, comprising:

a first power module, wherein the first power module is configured to receive a first voltage and to provide a second voltage; and

a second power module and a third power module, wherein each of the second power module and the third power module is electrically connected to the first power module to receive the second voltage, the second power module provides a third voltage to the chip, and the third power module provides a fourth voltage to the chip,

wherein the first power module and the second power module are located on a first surface of the mainboard, the third power module is located on a second surface of the mainboard, and the first surface and the second surface are opposite to each other.

23 . The system according to claim 22 , wherein

projections of the second power module and the third power module on the mainboard are at least partly overlapped.

24 . The system according to claim 22 , wherein

projections of the first power module and the third power module on the mainboard are at least partly overlapped.

25 . A system of providing power to a chip on a mainboard, comprising:

a first power module and a second power module, wherein each of the first power module and the second power module is configured to receive a first voltage, the first power module provides a second voltage, and the second power module provides a third voltage; and

a third power module and a fourth power module, wherein the third power module is electrically connected to the first power module to receive the second voltage, the fourth power module is electrically connected to the second power module to receive the third voltage, the third power module provides a fourth voltage to the chip, the fourth power module provides a fifth voltage to the chip;

wherein the first power module and the second power module are located on a first surface of the mainboard, the third power module and the fourth power module are located on a second surface of the mainboard, and the first surface and the second surface are opposite to each other.

26 . The system according to claim 25 , wherein

projections of the first power module and the third power module on the mainboard are at least partly overlapped, and projections of the second power module and the fourth power module on the mainboard are at least partly overlapped.

Assignments (1)

Priority Claims (1)

Continuity (4)

References Cited (78)