Memory cell including dual-antifuse device, memory structure, and operating method
Disclosed is a memory cell including a dual-antifuse device between a first pass-gate transistor and a second pass-gate transistor. The dual-antifuse device includes first and second antifuses having a common terminal and each also having an additional terminal opposite the common terminal. The first pass-gate transistor is connected between a first bitline and the additional terminal of the first pass-gate transistor. The second pass-gate transistor is connected between a second bitline and the additional terminal of the second pass-gate transistor. The common terminal of the first and second antifuses and gates of the first and second pass-gate transistors are connected to a wordline. Also disclosed is a memory structure including an array of such memory cells and an associated operating method. Within the array, different wordline and bitline bias conditions can be employed in order to reliably perform programming or read operations of a selected antifuse in a selected cell.
1 . A structure comprising:
a dual-antifuse device including a first antifuse and a second antifuse, wherein the first antifuse and the second antifuse have a common terminal connected to a wordline, wherein the first antifuse has a first additional terminal, and the second antifuse has a second additional terminal electrically isolated from the first additional terminal;
a first pass-gate transistor connected between a first bitline and the first additional terminal; and
a second pass-gate transistor connected between the second additional terminal and a second bitline, wherein gates of the first pass-gate transistor and the second pass-gate transistor are connected to the wordline.
2 . The structure of claim 1 , wherein the dual-antifuse device includes:
a first conductive region and a second conductive region in a semiconductor layer,
wherein the semiconductor layer has a first surface and a second surface opposite the first surface,
wherein the first conductive region and the second conductive region are adjacent to the second surface, and
wherein the first conductive region is electrically isolated from the second conductive region;
a trench extending into the semiconductor layer from the second surface, wherein the trench is positioned laterally between and immediately adjacent to the first conductive region and the second conductive region, wherein the trench has a lower portion filled with isolation material and an upper portion above the lower portion;
a dielectric layer lining the upper portion of the trench above the isolation material and further extending laterally onto the second surface partially over the first conductive region and the second conductive region; and
a conductive polycrystalline semiconductor layer on the dielectric layer.
3 . The structure of claim 2 ,
wherein the first antifuse includes the first conductive region, the conductive polycrystalline semiconductor layer, and a first portion of the dielectric layer between the first conductive region and the conductive polycrystalline semiconductor layer,
wherein the second antifuse includes the second conductive region, the conductive polycrystalline semiconductor layer, and a second portion of the dielectric layer between the second conductive region and the conductive polycrystalline semiconductor layer, and
wherein the common terminal includes the conductive polycrystalline semiconductor layer, the first additional terminal includes the first conductive region, and the second additional terminal includes the second conductive region.
4 . The structure of claim 2 , wherein the first conductive region, the second conductive region, and the conductive polycrystalline semiconductor layer have N-type conductivity.
5 . The structure of claim 1 , wherein the first pass-gate transistor and the second pass-gate transistor include N-type field effect transistors.
6 . The structure of claim 1 , wherein the first antifuse and the second antifuse are individually programmable and readable.
7 . A structure comprising:
an array of cells arranged in rows and columns;
wordlines for the rows; and
first and second bitlines for the columns, wherein each cell includes:
a dual-antifuse device including a first antifuse and a second antifuse, wherein the first antifuse and the second antifuse have a common terminal connected to a wordline for a row, wherein the first antifuse has a first additional terminal, and the second antifuse has a second additional terminal electrically isolated from the first additional terminal;
a first pass-gate transistor connected between a first bitline for a column and the first additional terminal; and
a second pass-gate transistor connected between the second additional terminal and a second bitline for the column, wherein gates of the first pass-gate transistor and the second pass-gate transistor are connected to the wordline.
8 . The structure of claim 7 , wherein the dual-antifuse device includes:
a first conductive region and a second conductive region in a semiconductor layer,
wherein the semiconductor layer has a first surface and a second surface opposite the first surface,
wherein the first conductive region and the second conductive region are adjacent to the second surface, and
wherein the first conductive region is electrically isolated from the second conductive region;
a trench extending into the semiconductor layer from the second surface, wherein the trench is positioned laterally between and immediately adjacent to the first conductive region and the second conductive region, wherein the trench has a lower portion filled with isolation material and an upper portion above the lower portion;
a dielectric layer lining the upper portion of the trench above the isolation material and further extending laterally onto the second surface partially over the first conductive region and the second conductive region; and
a conductive polycrystalline semiconductor layer on the dielectric layer.
9 . The structure of claim 8 ,
wherein the first antifuse includes the first conductive region, the conductive polycrystalline semiconductor layer, and a first portion of the dielectric layer between the first conductive region and the conductive polycrystalline semiconductor layer,
wherein the second antifuse includes the second conductive region, the conductive polycrystalline semiconductor layer, and a second portion of the dielectric layer between the second conductive region and the conductive polycrystalline semiconductor layer, and
wherein the common terminal includes the conductive polycrystalline semiconductor layer, the first additional terminal includes the first conductive region, and the second additional terminal includes the second conductive region.
10 . The structure of claim 8 , wherein the first conductive region, the second conductive region, and the conductive polycrystalline semiconductor layer have N-type conductivity.
11 . The structure of claim 7 , wherein the first pass-gate transistor and the second pass-gate transistor include N-type field effect transistors.
12 . The structure of claim 7 , wherein the first antifuse and the second antifuse of each cell in the array are individually programmable and readable.
13 . The structure of claim 7 , further comprising peripheral circuitry including:
a column control block connected to the first and second bitlines; and
a row control block connected to the wordlines; and
a controller in communication with the column control block and the row control block.
14 . The structure of claim 13 , wherein the column control block and the row control block are configured to apply programming bias conditions to the wordlines and the first and second bitlines during programming of a selected antifuse in a selected cell, and wherein the programming bias conditions include:
applying a programming voltage to a specific wordline connected to the selected cell;
applying 0.0V to a specific bitline connected by a specific pass-gate transistor to the selected antifuse of the selected cell;
applying 0.0 volts (V) to all other wordlines; and
applying the programming voltage to all other bitlines.
15 . The structure of claim 13 , wherein the column control block and the row control block are configured to apply reading bias conditions to the wordlines and the first and second bitlines during reading of a selected antifuse in a selected cell in a specific row and a specific column, and wherein the reading bias conditions include:
applying a first positive supply voltage to a specific wordline connected to the selected cell;
applying 0.0V to a specific bitline connected by a specific pass-gate transistor to the selected antifuse of the selected cell;
applying 0.0 volts (V) to all other wordlines; and
applying a second positive supply voltage to all other bitlines, wherein the second positive supply voltage is at least twice the first positive supply voltage.
16 . A method comprising:
providing a structure, wherein the structure includes
an array of cells arranged in rows and columns;
wordlines for the rows; and
first and second bitlines for the columns, wherein each cell includes:
a dual-antifuse device including a first antifuse and a second antifuse, wherein the first antifuse and the second antifuse have a common terminal connected to a wordline for a row, wherein the first antifuse has a first additional terminal, and the second antifuse has a second additional terminal electrically isolated from the first additional terminal;
a first pass-gate transistor connected between a first bitline for a column and the first additional terminal; and
a second pass-gate transistor connected between the second additional terminal and a second bitline for the column, wherein gates of the first pass-gate transistor and the second pass-gate transistor are connected to the wordline; and
selectively and individually performing operations directed to selected antifuses of selected cells in the array.
17 . The method of claim 16 , wherein the selectively and individually performing of the operations includes performing a programming operation directed to a selected antifuse in a selected cell by:
applying a programming voltage to a specific wordline connected to the selected cell;
applying 0.0V to a specific bitline connected by a specific pass-gate transistor to the selected antifuse of the selected cell;
applying 0.0 volts (V) to all other wordlines; and
applying the programming voltage to all other bitlines.
18 . The method of claim 16 , wherein the selectively and individually performing of the operations includes performing a read operation of a selected antifuse in a selected cell by:
applying a first positive supply voltage to a specific wordline connected to the selected cell;
applying 0.0V to a specific bitline connected by a specific pass-gate transistor to the selected antifuse of the selected cell;
applying 0.0 volts (V) to all other wordlines; and
applying a second positive supply voltage to all other bitlines, wherein the second positive supply voltage is at least twice the first positive supply voltage.
19 . The method of claim 18 , wherein the performing of the read operation further includes sensing a parameter change on the specific bitline.
20 . The method of claim 16 ,
wherein the dual-antifuse device includes:
a first conductive region and a second conductive region in a semiconductor layer,
wherein the semiconductor layer has a first surface and a second surface opposite the first surface,
wherein the first conductive region and the second conductive region are adjacent to the second surface, and
wherein the first conductive region is electrically isolated from the second conductive region;
a trench extending into the semiconductor layer from the second surface, wherein the trench is positioned laterally between and immediately adjacent to the first conductive region and the second conductive region, wherein the trench has a lower portion filled with isolation material and an upper portion above the lower portion;
a dielectric layer lining the upper portion of the trench above the isolation material and further extending laterally onto the second surface partially over the first conductive region and the second conductive region; and
a conductive polycrystalline semiconductor layer on the dielectric layer,
wherein the first antifuse includes the first conductive region, the conductive polycrystalline semiconductor layer, and a first portion of the dielectric layer between the first conductive region and the conductive polycrystalline semiconductor layer,
wherein the second antifuse includes the second conductive region, the conductive polycrystalline semiconductor layer, and a second portion of the dielectric layer between the second conductive region and the conductive polycrystalline semiconductor layer, and
wherein the common terminal includes the conductive polycrystalline semiconductor layer, the first additional terminal includes the first conductive region, and the second additional terminal includes the second conductive region.