Core layer comprising system-in-package, resulting information carrying card, and methods of making the same
The present disclosure provides a core sheet, a core layer comprising the core sheet for an information carrying card, an information carrying card comprising the same, and the methods of making the core sheet, the core layer, and the information carrying card. The core layer comprises a core sheet, which includes a substrate film and a plurality of component sections, Each component section comprises an antenna structure disposed on or embedded within the substrate film, and a system-in-package comprising at least one chip. The system-in-package is disposed on or embedded within the substrate film and electrically connected with the antenna structure. The antenna structure is made of a conductive material. The core layer further includes a crosslinked polymer composition disposed on both side of the substrate film. The substrate film may be centered in the crosslinked composition in a direction normal to a plane of the core layer.
1 . A core layer, comprising:
a substrate film;
a core sheet comprising a plurality of component sections, wherein each component section comprises
an antenna structure disposed on or at least partially embedded within the substrate film, the antenna structure comprising a wire made of a conductive material, and
a system-in-package (SiP) comprising at least two chips disposed on or embedded within the substrate film, and electrically connected with the antenna structure; and
a crosslinked polymer composition disposed on both side of the substrate film, wherein the substrate film is centered in the crosslinked composition in a direction normal to a plane of the core layer.
2 . The core layer of claim 1 , wherein the substrate film comprises a polymer, a paper, plasticized paper, a composite, or any combination thereof.
3 . The core layer of claim 1 , wherein the substrate film is a first thermoplastic layer made of a thermoplastic polymer.
4 . The core layer of claim 1 , wherein the antenna structure is made of a wire or a thread, and the conductive material comprises a metal.
5 . The core layer of claim 1 , wherein the conductive material is made of copper or copper alloy.
6 . The core layer of claim 1 , wherein the antenna structure and the system-in-package are connected by laser melting of the conductive material or by a conductive tape.
7 . The core layer of claim 1 , wherein the system-in-package comprises at least three chips for different functions.
8 . The core layer of claim 1 , wherein the antenna structure is configured to generate energy through induction in magnetic field, and the core layer includes no battery.
9 . The core layer of claim 1 , further comprising a light emitting diode (LED) electrically connected with the SiP and the antenna structure.
10 . The core layer of claim 1 , wherein a core sheet including the substrate film, the antenna structure and the SiP is self-centered in a crosslinkable polymer during curing in a thermal lamination process under a temperature and a pressure.
11 . A method of making the core layer of claim 1 , comprising
forming the core sheet on the substrate film;
applying a crosslinkable polymer composition in a liquid or paste form to both sides of the core sheet in a press for lamination; and
curing the crosslinkable polymer composition through heating and/or radiation under a pressure so as to form the core layer, wherein the crosslinkable polymer composition is converted into the crosslinked polymer composition.
12 . The method of claim 11 , wherein forming the core sheet on the substrate film comprises:
providing the SIP in each section of the core sheet on the substrate film;
providing or forming the antenna structure in each section of the core sheet on the substrate film; and
electrically connecting the antenna structure with the SIP in each section of the core sheet.
13 . The method of claim 12 , wherein the antenna structure and the SiP are connected by laser melting of the conductive material or by a conductive tape.
14 . The method of claim 11 , wherein the conductive material in the antenna structure is applied on the substrate film through vapor deposition, printing, or cladding technique, or any combination thereof.
15 . The core layer of claim 1 , wherein the core layer is configured to be used for making a plurality of articles for information carrying, and the plurality of articles are cards, tags, or inserts.
16 . The core layer of claim 1 , wherein the antenna structure comprises a first portion including a number of loops and a second portion including a waveform structure.
17 . An article for information carrying, comprising a core layer, the core layer comprising:
a substrate film;
a core sheet, each section of the core sheet comprising
an antenna structure disposed on or at least partially embedded within the substrate film, the antenna structure comprising a wire made of a conductive material, and
a system-in-package (SiP) comprising at least two chips disposed on or embedded within the substrate film, and electrically connected with the antenna structure; and
a crosslinked polymer composition disposed on both side of the substrate film, wherein the substrate film is centered in the crosslinked composition in a direction normal to a plane of the core layer.
18 . The article of claim 17 , wherein the substrate film comprises a polymer, a paper, plasticized paper, a composite, or any combination thereof.
19 . The article of claim 17 , wherein the substrate film is a first thermoplastic layer made of a thermoplastic polymer.
20 . The article of claim 17 , wherein the antenna structure is made of a wire or a thread, and the conductive material comprises a metal.
21 . The article of claim 17 , wherein the conductive material is made of copper or copper alloy.
22 . The article of claim 17 , wherein the antenna structure and the system-in-package are connected by laser melting of the conductive material or by a conductive tape.
23 . The article of claim 17 , wherein the system-in-package comprises at least two or three chips for different functions.
24 . The article of claim 17 , wherein the antenna structure is configured to generate energy through induction in magnetic field, and the core layer includes no battery.
25 . The article of claim 17 , further comprising a light emitting diode (LED) electrically connected with the SiP and the antenna structure.
26 . The article of claim 17 , wherein a core sheet including the substrate film, the antenna structure and the SiP is self-centered in a crosslinkable polymer during curing in a thermal lamination process under a temperature and a pressure.
27 . A method of making one or a plurality of the articles according to claim 16 , comprising:
making the core layer comprising a plurality of sections.
28 . A method of claim 27 , wherein the making the core layer comprises:
forming the core sheet on the substrate film;
applying a crosslinkable polymer composition in a liquid or paste form to both sides of the core sheet in a press for lamination; and
curing the crosslinkable polymer composition through heating and/or radiation under a pressure so as to form the core layer, wherein the crosslinkable polymer composition is converted into the crosslinked polymer composition.
29 . The method of claim 28 , wherein forming the core sheet on the substrate film comprises:
providing the SIP in each section of the core sheet on the substrate film;
providing or forming the antenna structure in each section of the core sheet on the substrate film; and
electrically connecting the antenna structure with the SIP in each section of the core sheet.
30 . The article of claim 17 , wherein the article is a card, a tag, or an insert.