Semiconductor circuit capable of swapping signal paths and semiconductor apparatus using the same
A semiconductor circuit includes a first pad, a second pad, swapping circuit, and an internal circuit. The internal circuit receives a first external signal and a second external signal, and generates a first internal signal and a second internal signal. Based on master information and swapping information, the swapping circuit couples the internal circuit to one of first and second pads to provide a path through which the first internal signal is output and a path through which the first external signal is received, and couples the internal circuit to the other of the first and second pads to provide a path through which the second internal signal is output and a path through which the second external signal is received.
1 . A semiconductor circuit comprising:
a first pad;
a second pad;
a third pad;
an internal circuit configured to receive a first external signal and a second external signal, and generate a first internal signal and a second internal signal; and
a swapping circuit configured to, based on master information, swapping information, and a mode signal, couple the internal circuit to the first pad to provide a path through which the first internal signal is output and a path through which the first external signal is received or couple the internal circuit to the first pad to provide a path through which the second internal signal is output and a path through which the second external signal is received, couple the internal circuit to the second pad to provide a path through which the second internal signal is output and a path through which the second external signal is received or couple the internal circuit to the second pad to provide a path through which the first internal signal is output and a path through which the first external signal is received, and couple the internal circuit to the third pad to provide a path through which the first external signal is received.
2 . The semiconductor circuit according to claim 1 , wherein, when the master information is a first logic level, the mode signal is a first logic level, and the swapping information is a second logic level, the swapping circuit is configured to couple the internal circuit to the first pad to provide a path through which the first internal signal is output and a path through which the first external signal is received and is configured to couple the internal circuit to the second pad to provide a path through which the second internal signal is output and a path through which the second external signal is received.
3 . The semiconductor circuit according to claim 2 , wherein, when the master information is a second logic level, the mode signal is the first logic level and the swapping information is the second logic level, the swapping circuit is configured to couple the internal circuit to the second pad to provide a path through which the first internal signal is output and a path through which the first external signal is received and is configured to couple the internal circuit to the first pad to provide a path through which the second internal signal is output and a path through which the second external signal is received.
4 . The semiconductor circuit according to claim 1 , wherein, when the master information is the first logic level, the mode signal is a second logic level and the swapping information is the second logic level, the swapping circuit is configured to couple the internal circuit to the first pad to provide a path through which the first internal signal is output, couple the internal circuit to the second pad to provide a path through which the second internal signal is output and a path through which the second external signal is received, and couple the internal circuit to the third pad to provide a path through which the first external signal is received.
5 . The semiconductor circuit according to claim 4 , wherein, when the master information is the second logic level, the mode signal is the second logic level and the swapping information is the second logic level, the swapping circuit is configured to couple the internal circuit to the first pad to provide a path through which the second internal signal is output and a path through which the second external signal is received, couple the internal circuit to the second pad to provide a path through which the first internal signal is output, and couple the internal circuit to the third pad to provide a path through which the first external signal is received.
6 . The semiconductor circuit according to claim 1 , wherein, when the mode signal is a first logic level, the swapping circuit is configured to provide a path through which a power supply voltage is output, to the third pad, and
when the mode signal is a second logic level, the swapping circuit is configured to couple the internal circuit to the third pad to provide a path through which the first external signal is received.
7 . The semiconductor circuit according to claim 1 , wherein the swapping circuit comprises:
a pad selection circuit configured to output a signal, transmitted through a first node, through the first pad based on a first transmission control signal, output a signal, received through the first pad, to a second node based on a first reception control signal, output a signal, transmitted through a third node, through the second pad based on a second transmission control signal, output a signal, received through the second pad, to a fourth node based on a second reception control signal, output a power supply voltage to the third pad based on a third transmission control signal, and receive a signal, received through the third pad, based on a third reception control signal;
a transmission selection circuit configured to, based on a swapping control signal, output one of the first internal signal and the second internal signal to the first node, and output the other of the first internal signal and the second internal signal to the third node; and
a reception selection circuit configured to output a signal, received through one of the fourth node and the third pad, to a fifth node based on the mode signal, output the second external signal from one of the second node and the fourth node based on the swapping control signal, and output the first external signal from one of the second node and the fifth node based on the swapping control signal and the mode signal.
8 . The semiconductor circuit according to claim 7 , further comprising:
a swapping control circuit configured to, based on the master information, the swapping information, and the mode signal, generate the first transmission control signal, the second transmission control signal, the third transmission control signal, the first reception control signal, the second reception control signal, the third reception control signal, and the swapping control signal.
9 . The semiconductor circuit according to claim 1 , further comprising:
a fourth pad coupled to one of a terminal to which a first power supply voltage is supplied and a terminal to which a second power supply voltage is supplied to receive the master information;
a fifth pad coupled to one of a terminal to which the first power supply voltage is supplied and a terminal to which the second power supply voltage is supplied to receive the swapping information; and
a sixth pad coupled to one of a terminal to which the first power supply voltage is supplied and a terminal to which the second power supply voltage is supplied to receive the mode signal.
10 . The semiconductor circuit according to claim 1 , further comprising:
a fourth pad coupled to a pad of another semiconductor circuit to receive the master information;
a fifth pad coupled to one of a terminal to which a first power supply voltage is supplied and a terminal to which a second power supply voltage is supplied to receive the swapping information; and
a sixth pad coupled to one of a terminal to which the first power supply voltage is supplied and a terminal to which the second power supply voltage is supplied to receive the mode signal.
11 . A semiconductor apparatus comprising a plurality of semiconductor chips,
wherein a first semiconductor chip among the plurality of semiconductor chips comprises:
a first pad;
a second pad;
a third pad; and
a swapping circuit configured to, based on whether the first semiconductor chip is a master chip or a slave chip, whether the number of the semiconductor chips is two or four, and whether the semiconductor apparatus operates in a swapping mode, couple the first pad to a path through which the first internal signal is output and a path through which the first external signal is received or couple the first pad to a path through which the second internal signal is output and a path through which the second external signal is received, couple the second pad to a path through which the second internal signal is output and a path through which the second external signal is received or couple the second pad to a path through which the first internal signal is output and a path through which the first external signal is received, and couple the third pad to a path through which the first external signal is received.
12 . The semiconductor apparatus according to claim 11 , wherein, when the first chip is the master chip, the number of the semiconductor chips is two, and the semiconductor apparatus operates in the swapping mode, the swapping circuit is configured to couple the first pad to the path through which the first internal signal is output and the path through which the first external signal is received and is configured to couple the second pad to the path through which the second internal signal is output and the path through which the second external signal is received.
13 . The semiconductor apparatus according to claim 12 , wherein the swapping circuit is configured to provide a power supply voltage to the third pad.
14 . The semiconductor circuit according to claim 11 , wherein, when the first chip is the slave chip, the number of the semiconductor chips is two, and the semiconductor apparatus operates in the swapping mode, the swapping circuit is configured to couple the second pad to the path through which the first internal signal is output and the path through which the first external signal is received and is configured to couple the first pad to the path through which the second internal signal is output and the path through which the second external signal is received.
15 . The semiconductor apparatus according to claim 14 , wherein the swapping circuit is configured to provide a power supply voltage to the third pad.
16 . The semiconductor circuit according to claim 11 , wherein, when the first chip is the master chip, the number of the semiconductor chips is four, and the semiconductor apparatus operates in the swapping mode, the swapping circuit is configured to couple the first pad to the path through which the first internal signal is output, couple the second pad to the path through which the second internal signal is output and a path through which the second external signal is received, and couple the third pad to provide a path through which the first external signal is received.
17 . The semiconductor circuit according to claim 11 , wherein, when the first chip is the slave chip, the number of the semiconductor chips is four, and the semiconductor apparatus operates in the swapping mode, the swapping circuit is configured to couple the first pad to the path through which the second internal signal is output and the path through which the second external signal is received, couple the second pad to the path through which the first internal signal is output, and couple the third pad to the path through which the first external signal is received.