IP Library Granted Patent US 12,733,133
Granted Patent B2
US 12,733,133 · App. 18/900,139 · Granted Sep 8, 2026

Heat sink

Inventors: Hirofumi Aoki (Tokyo, JP); Kenya Kawabata (Tokyo, JP)
Assignee: FURUKAWA ELECTRIC CO., LTD.
H05K7/2039H05K7/20336
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Quick Facts
Patent No.
US 12,733,133
App. No.
18/900,139
Granted
Sep 8, 2026
Kind
B2
Abstract

Provided is a heat sink that can prevent dryout without impairing heat transfer characteristics even when an environmental temperature at the time of use is lower than a melting point of a working fluid. The heat sink includes a heat transport member including a heat receiving part thermally connected to a heat generating body, and a first heat radiating fin group in which a plurality of first heat radiating fins are arranged, the first heat radiating fin group being thermally connected to the heat transport member at a heat radiating part, the heat transport member has an inner space that communicates from the heat receiving part to the heat radiating part and in which a working fluid is sealed, and a heat transfer member is thermally connected to a heat insulating part located between the heat receiving part and the heat radiating part of the heat transport member.

Claims (12)

1 . A heat sink comprising:

a heat transport container including a heat receiving part thermally connected to a heat generating body;

a first heat radiating fin group in which a plurality of first heat radiating fins are arranged, the first heat radiating fin group being thermally connected to the heat transport container at a heat radiating part; and

a second heat radiating fin group in which a plurality of second heat radiating fins are arranged, the second heat radiating fin group being thermally connected to the heat transport container at a heat insulating part,

wherein the heat insulating part is located between the heat receiving part and the heat radiating part,

wherein the heat transport container has a first inner space that communicates from the heat receiving part to the heat radiating part via the heat insulating part, and in which a first working fluid is sealed,

wherein the second heat radiating fin group is spaced from the first heat radiating fin group, and

wherein the second fin group has a fin area that is smaller than a fin area of the first heat radiating fin group.

2 . The heat sink according to claim 1 , further comprising a heat pipe located within the heat transfer container, the heat pipe having a second inner space in which a second working fluid is sealed.

3 . The heat sink according to claim 2 , wherein the heat pipe extends from the heat insulating part to the heat receiving part.

4 . The heat sink according to claim 1 , wherein the first inner space of the heat transport container is a single integral space.

5 . The heat sink according to claim 1 , wherein the heat radiating part of the heat transport container has a larger width than the heat receiving part.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2024
From: AOKI, HIROFUMI; KAWABATA, KENYA
To: FURUKAWA ELECTRIC CO., LTD.
Reel/Frame 069215/0548 →
Priority Claims (1)
JP 2022-054633 · Mar 29, 2022 · national
Continuity (2)
Continuation PCTJP2023006683 · Feb 24, 2023
Related Publication 20250024645A1 · Jan 16, 2025
References Cited (34)
US 5697428A · Akachi et al. · 1997 [cited by applicant]
US 7343962B2 · Xia · 2008 [cited by examiner]
US 7443677B1 · Zhou · 2008 [cited by examiner]
US 7613001B1 · Liu · 2009 [cited by examiner]
US 10119759B2 · Watanabe · 2018 [cited by examiner]
US 10371457B2 · Chen · 2019 [cited by examiner]
US 10598441B2 · Kawabata · 2020 [cited by examiner]
US 10677535B1 · Kawabata · 2020 [cited by examiner]
US 10760855B2 · Watanabe · 2020 [cited by examiner]
US 10809011B2 · Chu · 2020 [cited by examiner]
US 11085703B2 · Watanabe · 2021 [cited by examiner]
US 11112186B2 · Watanabe · 2021 [cited by examiner]
US 11817372B2 · Lin · 2023 [cited by examiner]
US 12173966B2 · Kubo · 2024 [cited by examiner]
US 20130014920A1 · Chao · 2013 [cited by examiner]
US 20180017335A1 · Lin · 2018 [cited by examiner]
US 20190323779A1 · Kawabata · 2019 [cited by examiner]
US 20200393201A1 · Watanabe et al. · 2020 [cited by applicant]
US 20210007246A1 · Watanabe · 2021 [cited by examiner]
US 20210033356A1 · Chen · 2021 [cited by examiner]
US 20230013442A1 · Lan · 2023 [cited by examiner]
CN 111836515A · 2020 [cited by applicant]
CN 212876430U · 2021 [cited by applicant]
EP 3758057A1 · 2020 [cited by applicant]
JP 61125531A · 1986 [cited by applicant]
JP 763487A · 1995 [cited by applicant]
JP 20059752A · 2005 [cited by applicant]
JP 2020176752A · 2020 [cited by applicant]
TW I289041I · 2007 [cited by applicant]
International Search Report and Written Opinion dated Apr. 11, 2023 from corresponding International Patent Application No. PCT/JP2023/006683, 13 pages. [cited by applicant]
International Preliminary Report on Patentability dated Oct. 10, 2024 from corresponding International Patent Application No. PCT/JP2023/006683, 11 pages. [cited by applicant]
Japanese Notice of Reasons for Refusal dated Sep. 25, 2023 from corresponding Japanese Patent Application No. 2023-532349, 8 pages. [cited by applicant]
Taiwan Notice of the Opinion on Examination dated Nov. 23, 2023 from corresponding Taiwan Patent Application No. 112107744, 14 pages. [cited by applicant]
Chinese First Notice of Examination Opinion dated Sep. 18, 2024 from corresponding Chinese Patent Application No. 2023900000126.1, 4 pages. [cited by applicant]