Split formation of unitary substrates
Methods of forming a laminate may include conveying a first substrate through a first nip, where a first source of vibration energy may be used to alter a portion of the first substrate in the first nip to create an altered area. The method may include conveying the first substrate with the altered area and a second substrate into a second nip and using a second source of vibration energy to join the first substrate to the second substrate in the second nip.
1 . A method of forming a laminate comprising:
providing a first device comprising an outer surface;
providing a second device comprising a first source of vibration energy;
forming a first nip between the first source of vibration energy and the outer surface;
conveying a first substrate through the first nip;
using the first source of vibration energy to alter a portion of the first substrate in the first nip to create an altered area;
providing a third device comprising a second source of vibration energy;
forming a second nip between the second source of vibration energy and the outer surface;
wherein the second nip is downstream of the first nip;
conveying the first substrate with the altered area and a second substrate into the second nip; and
using the second source of vibration energy to join the first substrate to the second substrate in the second nip.
2 . The method of claim 1 , wherein the second substrate is not conveyed through the first nip.
3 . The method of claim 1 , wherein the first substrate comprises a film.
4 . The method of claim 1 , wherein the first substrate comprises a bicomponent nonwoven.
5 . The method of claim 1 , wherein the second substrate is a nonwoven.
6 . The method of claim 1 , comprising intermittently altering the portion of the first substrate in the first nip to form intermittent altered areas.
7 . The method of claim 1 , comprising imparting thermal energy to the portion of the first substrate upstream of the first nip to heat the portion of the first substrate to a temperature below a melting temperature of the portion of the first substrate, wherein the temperature below the melting temperature of the portion of the first substrate is in a range of about 90 degrees C. to about 160 degrees C.
8 . The method of claim 1 , wherein the first substrate has a first width, wherein the second substrate has a second width, and wherein the first width is narrower than the second width.
9 . The method of claim 1 , wherein the first substrate comprises a first strip of material and a second strip of material, and wherein the second substrate has a width that is greater than a width of the first strip of material and a width the second strip of material combined.
10 . The method of claim 1 , wherein the first source of vibration energy or the second source of vibration energy is a rotary sonotrode.
11 . The method of claim 1 , wherein the first source of vibration energy or the second source of vibration energy is a blade sonotrode.
12 . The method of claim 1 , comprising heating the outer surface of the first device.
13 . The method of claim 1 , wherein the first substrate is joined to the second substrate in areas not comprising the altered area.
14 . The method of claim 1 , comprising cooling the first source of vibration energy, the second source of vibration energy, and/or the outer surface of the first device.
15 . The method of claim 1 , comprising providing a plurality of recesses in the outer surface of the first device, wherein the recesses have a shape configured to produce projections in the altered area suitable for use in a touch fastener.
16 . The method of claim 1 , wherein the altered area comprises hooks for a touch fastener.
17 . The method of claim 1 , comprising flatting areas of the first substrate upstream of the first nip.
18 . A method of forming a laminate comprising:
providing a first device comprising an outer surface;
providing a second device comprising a first source of vibration energy;
forming a first nip between the first source of vibration energy and the outer surface;
conveying a first substrate through the first nip;
using the first source of vibration energy to alter a portion of a machine directional lane of the first substrate in the first nip to create an altered area;
providing a third device comprising a second source of vibration energy;
forming a second nip between the second source of vibration energy and the outer surface;
wherein the second nip is downstream of the first nip;
conveying the first substrate with the altered area and a second substrate into the second nip, wherein the first substrate has a first cross-directional width, wherein the second substrate has a second cross-directional width, and wherein the second cross-directional width is larger than the first cross-directional width; and
using the second source of vibration energy to join the first substrate to the second substrate in the second nip.
19 . The method of claim 18 , wherein the altered area is intermittent in the machine directional lane.
20 . The method of claim 19 , wherein the first substrate is joined to the second substrate intermediate the intermittent altered areas.