Dissimilar material solid phase bonding method, and dissimilar material solid phase bonded structure
The present invention provides dissimilar material solid phase bonding with which a robust bonded portion of metal materials having different compositions can be formed efficiently. The present invention also provides a dissimilar material solid phase bonded structure having a dissimilar material solid phase bonded portion in which metal materials having different compositions have been bonded together robustly. In the dissimilar material solid phase bonding method according to the present invention, one member is brought into contact with another member to form an interface to be bonded, and newly formed surfaces of the one member and the other member are formed at the interface to be bonded, by means of the application of a bonding load, characterized in that: the one member and the other member have different compositions; the temperature at which the one member and the other member have substantially the same strength is defined as a bonding temperature; and the bonding load at which strength is applied substantially perpendicular to the interface to be bonded is set.
1 . A dissimilar material solid phase bonding method where one member is brought into contact with another member to form an interface to be bonded, and newly formed surfaces of the one member and the other member are formed at the interface to be bonded, by applying a bonding load, wherein:
the one member and the other member have different compositions;
a temperature at which the one member and the other member have substantially a same strength is defined as a bonding temperature; and
the bonding load at which strength is applied substantially perpendicular to the interface to be bonded is set;
wherein the one member and the other member are bonded at the bonding temperature and the bonding load.
2 . The dissimilar material solid phase bonding method according to claim 1 , wherein a temperature of the interface to be bonded is raised by frictional heat generated by sliding of the one member and the other member.
3 . The dissimilar material solid phase bonding method according to claim 1 , wherein a temperature of the interface to be bonded is raised by using resistance heating.
4 . The dissimilar material solid phase bonding method according to claim 1 , wherein a burn-off length is set so that the the newly formed surfaces of the one member and the other member are formed in substantially an entire area of the interface to be bonded in the one member and/or the other member.
5 . The dissimilar material solid phase bonding method according to claim 1 , wherein, the bonding temperature is created by subjecting the one member and/or the other member to external cooling and/or external heating.
6 . The dissimilar material solid phase bonding method according to claim 1 , wherein the one member and/or the other member is an iron-based metal member.
7 . The dissimilar material solid phase bonding method according to claim 1 , wherein,
by measuring a temperature in the vicinity of the interface to be bonded and the bonding load during bonding, and comparing the obtained measured temperature with the bonding temperature,
when the measured temperature is higher than the bonding temperature, the bonding load is increased, and
when the measured temperature is lower than the bonding temperature, the bonding load is decreased.