Semiconductor packaging
Disclosed is a semiconductor packaging. The semiconductor packing comprises a substrate on which a semiconductor device is arranged on a front surface; a channel member disposed on a rear surface of the substrate and forming a cooling flow path through which a refrigerant moves; and a porous diamond layer covering an outer surface of the channel member.
1 . A semiconductor packaging comprising:
a substrate on which a semiconductor device is arranged on a front surface;
a channel member disposed on a rear surface of the substrate and forming a cooling flow path through which a refrigerant moves;
a porous diamond layer with a first pore size covering an outer surface of the channel member;
a porous layer with a second pore size stacked on the porous diamond layer and having wettability different from the porous diamond layer;
a refrigerant inlet and a refrigerant outlet arranged with the channel member in-between, and communicating with the cooling flow path;
a case in which the channel member is located inside; and
a manifold member disposed on one side of the channel member, the manifold member configured to be in parallel with a direction of movement of the refrigerant and to form a first transfer flow path and a second transfer flow path, the first transfer flow path connecting a refrigerant inlet with the cooling flow path and the second transfer flow path connecting a refrigerant outlet with the cooling flow path;
wherein one of the porous layer and the porous diamond layer is hydrophilic and an other of the porous layer and the porous diamond layer is hydrophobic;
wherein the second pore size of the porous layer is different from the first pore size of the porous diamond layer;
wherein the refrigerant inlet and the refrigerant outlet are formed in the case;
wherein the first transfer flow path has a first end open to communicate with the refrigerant inlet and a second end closed; and
wherein the second transfer flow path has a first end closed and a second end open to communicate with the refrigerant outlet.
2 . The semiconductor packaging of claim 1 , wherein the channel member comprises a plurality of pin members disposed to be spaced apart from each other and forming the cooling flow path therebetween.
3 . The semiconductor packaging of claim 1 , wherein a cross-sectional area of the first transfer flow path and a cross-sectional area of the second transfer flow path are each greater than a cross-sectional area of the cooling flow path.
4 . The semiconductor packaging of claim 1 , wherein the substrate and the channel member are formed with a same material.