Electronic device

1 . An electronic device, comprising:

a first electronic component having a first edge;

a first interposer;

a first interconnection array disposed in the first interposer and electrically connected to ground;

a first shielding wall continuously extending at a side of the first interconnection array; and

a second interconnection array disposed between the first shielding wall and the first interconnection array, wherein the second interconnection array is configured to transmit a signal,

wherein the first interconnection array, the second interconnection array, and the first shielding wall are located at the first edge of the first electronic component.

2 . The electronic device of claim 1 , wherein the first interconnection array and the second interconnection array constitute a first interconnection structure with two columns between the first shielding wall and the first edge of the first electronic component.

3 . The electronic device of claim 2 , further comprising:

a third interconnection array disposed in the first interposer and electrically connected to ground;

a second shielding wall; and

a fourth interconnection array disposed between the second shielding wall and the third interconnection array,

wherein the first electronic component has a second edge substantially orthogonal to the first edge in a top view, and the third interconnection array, the fourth interconnection array, and the second shielding wall are located at the second edge of the first electronic component.

4 . The electronic device of claim 3 , wherein the third interconnection array and the fourth interconnection array constitute a second interconnection structure with two rows between the second shielding wall and the second edge of the first electronic component.

5 . The electronic device of claim 2 , wherein no additional interconnection array is disposed between the second interconnection array and the first shielding wall and between the first interconnection array and the first edge of the first electronic component.

6 . The electronic device of claim 5 , wherein the first interposer comprises a dielectric layer encapsulating the first interconnection array and the second interconnection array, and the first shielding wall is disposed on an external side of the dielectric layer.

7 . The electronic device of claim 1 , further comprising:

a second electronic component electrically connected to the first electronic component, wherein an active surface of the first electronic component faces an active surface of the second electronic component.

8 . The electronic device of claim 1 , wherein the first shielding wall is disposed along a first side of the first interposer and spaced apart from the first interposer.

9 . The electronic device of claim 8 , wherein the first interconnection array is spaced apart from the second interconnection array by at least one medium, and the second interconnection array is spaced apart from the first shielding wall by at least two mediums.

10 . The electronic device of claim 9 , wherein the first interposer comprises a dielectric layer encapsulating the first interconnection array and the second interconnection array.

11 . The electronic device of claim 1 , further comprising:

an encapsulant encapsulating the first interposer and contacting the first shielding wall.

12 . The electronic device of claim 1 , wherein the first shielding wall is configured to cover at least two edges of the first interposer and to prevent the second interconnection array from electromagnetic interference.

13 . The electronic device of claim 1 , wherein

the first interposer has a first edge and a second edge opposite to the first edge, the first interconnection array comprises a first interconnection, and the second interconnection array comprises a second interconnection abutting the first interconnection,

and wherein a projected length from the first interconnection to the second interconnection is greater than a first distance between the second interconnection and the first edge of the first interposer, and wherein the projected length is a projection of a length starting at the first interconnection and ending at the second interconnection as projected on an imaginary plane perpendicular to the first edge of the first interposer.

14 . The electronic device of claim 13 , wherein a second distance between the first interconnection and the first edge of the first interposer is greater than the first distance.

15 . The electronic device of claim 13 , wherein the second interconnection is closer to the first shielding wall than the first interconnection is.

16 . The electronic device of claim 13 , further comprising:

an encapsulant separating the first interposer from the first shielding wall.

17 . The electronic device of claim 1 , further comprising:

a first substrate; and

a second substrate disposed over the first substrate, wherein

the first interposer is disposed between the first substrate and the second substrate,

and the first shielding wall extends from a side of the first substrate to a side of the second substrate,

and wherein the first interconnection array and the first shielding wall are configured to prevent the second interconnection array from electromagnetic interference.

18 . The electronic device of claim 17 , further comprising:

an encapsulant disposed between the first substrate and the second substrate and located between the first shielding wall and a lateral side of the first interposer.

19 . The electronic device of claim 17 ,

wherein the first electronic component is disposed between the first substrate and the second substrate, and wherein the first electronic component is electrically connected to the second interconnection array.

20 . The electronic device of claim 19 , further comprising:

a second electronic component disposed between the first electronic component and the second substrate,

wherein the second electronic component is electrically connected to the first electronic component through the second interconnection array.