Housing comprising plating layer and electronic device comprising housing
View Patent ↗An example housing of an electronic device may include a body including a first portion having a first curvature, and a second portion having a second curvature; an outer plating layer comprising a conductive material and disposed on an outer surface of the body unit to be spaced by a predetermined interval from a boundary between the first portion and the second portion; and a coating layer which is disposed on the outer surface of the body to cover the plating layer.
1 . An electronic device comprising:
a housing at least partially forming an exterior of the electronic device, the housing comprising:
a body comprising a first portion having a first curvature and a second portion having a second curvature different from the first curvature, and having an outer surface on which a trench is formed, the trench; comprising:
a valley that is concave with respect to the outer surface of the body, and
a peak that is convex with respect to the outer surface of the body, the peak of the trench including a truncated portion obtained by removing a portion of the peak,
an outer plating layer comprising a conductive material and disposed in the trench of the body to be spaced apart by a predetermined interval from a boundary between the first portion and the second portion; and
a coating layer disposed on the outer surface of the body to cover the outer plating layer.
2 . The electronic device of claim 1 , wherein a surface of the truncated portion is substantially parallel to the outer surface of the body.
3 . The electronic device of claim 1 , wherein the outer plating layer comprises a first sub-plating layer disposed to be spaced apart from the boundary by a first distance, and a second sub-plating layer spaced apart from the boundary by a second distance different from the first distance.
4 . The electronic device of claim 1 , further comprising an inner plating layer disposed on an inner surface of the body and comprising a conductive material.
5 . The electronic device of claim 4 , further comprising:
a hole provided at the body; and
a connection plating layer disposed in the hole and including a conductive material,
wherein the connection plating layer connects the outer plating layer to the inner plating layer.
6 . The electronic device of claim 5 , further comprising a filler disposed in the hole to fill the hole.
7 . The electronic device of claim 5 , wherein the hole has a diameter that varies along a direction from the outer surface toward the inner surface of the body.
8 . The electronic device of claim 5 , wherein the hole has a diameter that becomes smaller along a direction from the outer surface toward the inner surface of the body.
9 . The electronic device of claim 1 , wherein the coating layer comprises a compensation layer configured to compensate for a step difference between a portion where the outer plating layer is disposed and a portion where the outer plating layer is not disposed, a color layer, and a protective layer laminated on the color layer.
10 . A housing of an electronic device, the housing comprising:
a body comprising a first portion having a first curvature and a second portion having a second curvature different from the first curvature, and having an outer surface on which a trench is formed, the trench comprising:
a valley which is concave with respect to the outer surface of the body, and
a peak which is convex with respect to the outer surface of the body, the peak of the trench including a truncated portion obtained by removing a portion of the peak,
an outer plating layer comprising a conductive material and disposed in the trench of the body to be spaced apart by a predetermined interval from a boundary between the first portion and the second portion; and
a coating layer disposed on the outer surface of the body to cover the outer plating layer.
11 . The housing of claim 10 , wherein the outer plating layer comprises a first sub-plating layer disposed to be spaced apart from the boundary by a first distance, and a second sub-plating layer spaced apart from the boundary by a second distance different from the first distance.
12 . The housing of claim 10 , further comprising:
an inner plating layer disposed on an inner surface of the body and comprising a conductive material;
a hole provided in the body; and
a connection plating layer disposed in the hole and including a conductive material,
wherein the connection plating layer connects the outer plating layer to the inner plating layer.
13 . The housing of claim 12 , wherein the hole has a diameter that varies along a direction from the outer surface toward the inner surface of the body.
14 . The electronic device of claim 1 , wherein the truncated portion has a surface substantially parallel to the outer surface of the body adjacent the trench.