Dielectric layer for a semiconductor device and method of producing the same
A semiconductor device includes a low dielectric constant insulating film exhibiting an Si—H Fourier Transform Infrared (FTIR) doublet defined by a first and a second peak, wherein the first peak is located at a higher wave number than the second peak, and wherein the ratio of the first peak to the second peak is greater than unity. A method of producing such a semiconductor device includes depositing a dielectric layer over a substrate and treating the dielectric layer in a hydrogen containing plasma such that the dielectric layer exhibits an Si—H Fourier Transform Infrared (FTIR) doublet defined by a first and a second peak, wherein the first peak is located at a higher wave number than the second peak, and wherein the ratio of the first peak to the second peak is greater than unity.
1. A semiconductor device comprising a dielectric layer having a methyl group and exhibiting an SI—H Fourier Transform Infrared (FTIR) doublet defined by a first and a second peak, wherein the first peak is located at a higher wave number than the second peak, and wherein the ratio of the first peak to the second peak is greater than unity.
2. The semiconductor device as claimed in claim 1 , wherein a dielectric constant of the dielectric layer is less than 3.
3. A semiconductor device comprising a dielectric layer having a methyl group and exhibiting a C—H Fourier Transform Infrared (FTIR) peak, an Si—CH 3 ETIR peak, and an SI—H FTIR doublet defined by a first and a second peak, wherein the first peak is located at a higher wave number than the second peak, and wherein the ratio of the first peak to the second peak is greater than unity.
4. The semiconductor device as claimed in claim 3 , wherein a dielectric constant of the dielectric layer is less than 3.