Patent Assignment
Reel/Frame 018917/0079
Change of Name
Recorded: 2007-02-09
Received: 2007-02-15
Pages: 3
Assignor
TRIKON HOLDINGS LIMITED
Executed: 2005-12-02
Assignee
AVIZA EUROPE LIMITED
COED RHEDYN RINGLAND WAY, NEWPORT, GWENT, GBX, NP18, UNITED KINGDOM
Covered Properties
(29)
Method of Forming a Diffusion Barrier
Application:
10/946,310 →
Depositing a Tantalum Film
Application:
10/483,805 →
Damascene Structure with Integral Etch Stop Layer
Application:
10/484,168 →
Method of deposting a dielectric film
Application:
10/484,888 →
Electrostatic clamping of thin wafers in plasma processing vacuum chamber
Application:
10/760,464 →
Low Dielectric Constant Layers
Application:
10/482,971 →
Method for producing a copper connection
Application:
10/483,046 →
Method of depositing aluminium nitride
Application:
10/482,970 →
Magnetron sputtering apparatus
Application:
10/433,231 →
Method of filling a via or recess in a semiconductor substrate
Application:
10/471,995 →
Methods and Apparatus for Forming Precursors
Application:
10/471,785 →
Dielectric Layer for a Semiconductor Device and Method of Producing the Same
Application:
10/638,424 →
Deposition Methods and Apparatus
Application:
10/464,468 →
Method of Treating an Insulating Layer
Application:
10/438,876 →
Plasma Processing Apparatus
Application:
10/419,113 →
Forming Low K Dielectric Layers
Application:
10/298,225 →
Method of Forming a Patterned Metal Layer
Application:
10/290,283 →
Method of filling trenches
Application:
10/220,800 →
Magnetron Sputtering
Application:
10/275,439 →
Methods of Forming Nitride Films
Application:
10/242,762 →
Methods of sputtering using krypton
Application:
10/204,247 →
Electrostatic Clamping
Application:
10/182,869 →
Method of Etching a Substrate
Application:
10/106,823 →
Dielectric Layer for a Semiconductor Device and Method of Producing the Same
Application:
09/942,933 →
Method of Cooling an Induction Coil
Application:
09/834,880 →
Method of depositing dielectric
Application:
09/832,942 →
Method and Apparatus for Forming a Film on a Substrate
Application:
09/763,641 →
Inductive Coil Assembly Having Multiple Coil Segments for Plasma Processing Apparatus
Application:
09/673,081 →
Methods and Apparatus for Forming a Film on a Substrate
Application:
09/760,820 →