IP Library Granted Patent US 6,990,010
Granted Patent B1
US 6,990,010 · App. 10/636,346 · Granted Jan 24, 2006

Deglitching circuits for a radiation-hardened static random access memory based programmable architecture

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Quick Facts
Patent No.
US 6,990,010
App. No.
10/636,346
Filed
Aug 6, 2003
Granted
Jan 24, 2006
Kind
B1
Art Unit
2827
USPC
365/154
Abstract

The present invention comprises a device and a method for a deglitching circuit for a radiation tolerant static random access memory (SRAM) based field programmable gate array. The deglitching circuit for a radiation tolerant static random access memory (SRAM) based field programmable gate array comprises a configuration memory that has a plurality of configuration bits Read and write circuitry is provided to configure the plurality of configuration bits. A radiation hard latch is coupled to and controls a programmable element and an interface couples at least one of the plurality of configuration bits to the radiation hard latch when the write circuitry writes to the plurality of configuration bits.

Claims (18)

1. A deglitching circuit for a radiation tolerant static random access memory (SRAM) comprising:

a configuration memory having a plurality of configuration bits;

read and write circuitry coupled to said configuration memory to configure said plurality of configuration bits;

a radiation hard latch coupled to and controlling a programmable element, wherein said radiation hard latch comprises a plurality of inverters, the output of a first inverter of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters and the input of a first inverter is coupled to the output of a second inverter of said plurality of inverters, said plurality of inverters of said radiation hardened latch each comprises a pair of MOS transistors; and

an interface coupling at least one of said plurality of configuration bits to said radiation hard latch when said write circuitry writes to said at least one of said plurality of configuration bits.

2. The deglitching circuit for a radiation tolerant static random access memory according to claim 1 wherein said configuration memory comprises a plurality of inverters, wherein the output of a first of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters and the input of a first inverter is coupled to the output of a second inverter of said plurality of inverters.

3. The deglitching circuit for a radiation tolerant static random access memory according to claim 1 wherein said pair of P-channel MOS transistors have a W/L ratio of approximately 30/0.24 micrometers.

4. The deglitching circuit for a radiation tolerant static random access memory according to claim 1 wherein said pair of N-channel MOS transistors have a W/L ratio of approximately 15/0.24 micrometers.

5. The deglitching circuit for a radiation tolerant static random access memory according to claim 1 wherein said interface comprises a plurality of sets of gates.

6. A method of deglitching a circuit for a radiation tolerant static random access memory (SRAM) comprising:

providing a configuration memory having a plurality of configuration bits;

coupling read and write circuitry to said configuration memory to configure said plurality of configuration bits;

coupling a radiation hard latch coupled to a programmable element such that said radiation hard latch controls a programmable element, wherein said radiation hard latch comprises a plurality of inverters, the output of a first inverter of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters and the input of a first inverter is coupled to the output of a second inverter of said plurality of inverters said plurality of inverters of said radiation hardened latch each comprises a pair of MOS transistors; and

coupling an interface to at least one of said plurality of configuration bits to said radiation hard latch when said write circuitry writes to said at least one of said plurality of configuration bits.

7. The method of deglitching a circuit for a radiation tolerant static random access memory according to claim 6 wherein said configuration memory comprises a plurality of inverters, wherein the output of a first of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters and the input of a first inverter is coupled to the output of a second inverter of said plurality of inverters.

8. The method of deglitching a circuit for a radiation tolerant static random access memory according to claim 6 wherein said pair of P-channel MOS transistors have a W/L ratio of approximately 30/0.24 micrometers.

9. The method of deglitching a circuit for a radiation tolerant static random access memory according to claim 6 wherein said pair of N-channel MOS transistors have a W/L ratio of approximately 15/0.24 micrometers.

10. The method of deglitching a circuit for a radiation tolerant static random access memory according to claim 6 wherein said interface comprises a plurality of sets of gates.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037380/0504 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2003
From: PLANTS, WILLIAM C.
To: ACTEL CORPORATION
Reel/Frame 014772/0114 →