Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same
An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
1. An electrical assembly comprising:
a circuitized substrate including a first layer of organic dielectric material and a first electrically conductive circuit formed on said first layer of organic dielectric material, part of said first layer of organic dielectric material and a corresponding part of said first electrically conductive circuit forming a first, base portion of an organic memory device, a thin layer of organic polymer material positioned on said corresponding part of said at least one electrically conductive circuit which forms said first, base portion of said organic memory device, and a second electrically conductive circuit formed on said thin layer of organic polymer material, said second electrically conductive circuit and said corresponding part of said first electrically conductive circuit each comprising a plurality of narrow circuit lines which cross each other at predetermined locations to define points of contact at said locations, said thin layer of organic polymer material and said second electrically conductive circuit forming a second portion of said organic memory device;
a second layer of organic dielectric material positioned over said organic memory device;
a first electrical component positioned on said circuitized substrate and electrically coupled to said organic memory device through said second layer of organic dielectric material; and
a second electrical component positioned on said circuitized substrate and electrically coupled to said first electrical component.
2. The electrical assembly of claim 1 wherein said thin layer of organic polymer material comprises a ferroelectric thin film material.
3. The electrical assembly of claim 2 wherein said ferroelectric thin film material is selected from the group consisting of polyvinylidene and copolymers thereof, nylon and copolymers thereof, cyanopolymers and copolymers thereof, and combinations thereof.
4. The electrical assembly of claim 3 wherein said ferroelectric thin film material is polyvinylidene fluoride-trifluoroethylene, and has a thickness of from about 0.5 to about three microns.
5. The electrical assembly of claim 1 wherein selected ones of said circuit lines of said first and second electrically conductive circuits each have a width of from about five to about fifty microns.
6. The electrical assembly of claim 1 wherein said first layer of organic dielectric material comprises a polymer material.
7. The electrical assembly of claim 1 wherein said first layer of organic dielectric material is selected from the group of polymer materials consisting of fiberglass-reinforced epoxy resins, polytetrafluoroethylene, polyimides, polyamides, cyanate resins, photoimageable materials, and combinations thereof.
8. The electrical assembly of claim 1 wherein said first and second electrically conductive circuits are each comprised of a metal selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, conductive polymers, and combinations thereof.
9. The electrical assembly of claim 1 wherein each of said first and second electrical components positioned on said circuitized substrate comprises a chip carrier.
10. The electrical assembly of claim 1 wherein each of said first and second electrical components positioned on said circuitized substrate comprises a semiconductor chip.
11. The electrical assembly of claim 1 further including an optoelectronic connecting structure substantially within said circuitized substrate, said optoelectronic connecting structure providing at least part of said electrical coupling between said first and second electrical components.
12. The electrical assembly of claim 11 wherein said optoelectronic connecting structure comprises a plurality of physically connected openings and a quantity of transparent polymer material, said transparent polymer material being positioned within said plurality of physically connected openings.
13. The electrical assembly of claim 1 further including connecting structure for enabling passage of radio frequency signals between said first and second electrical components, said connecting structure for enabling passage of radio frequency signals between said first and second electrical components being positioned substantially within said circuitized substrate and providing at least part of said electrical coupling between said first and second electrical components.
14. The electrical assembly of claim 13 wherein said connecting structure for enabling passage of radio frequency signals between said first and second electrical components comprises at least one signal path and a shielding structure adapted for shielding said signal path during the passage for electrical signals of radio frequency wavelengths there-through.
15. The electrical assembly of claim 1 further including a heat sinking member positioned on said circuitized substrate for providing heat sinking of said organic memory device.
16. The electrical assembly of claim 1 further including a plurality of thru-holes within said second layer of organic dielectric material positioned over said organic memory device, said plurality of thru-holes electrically coupling said organic memory device to said first electrical component.
17. A method of making an electrical assembly, said method comprising:
providing a circuitized substrate including a first layer of organic dielectric material and a first electrically conductive circuit on said first layer of organic dielectric material, part of said first layer of organic dielectric material and a corresponding part of said first electrically conductive circuit forming a first, base portion of an organic memory device;
forming a thin layer of organic polymer material on said corresponding part of said at least one electrically conductive circuit which forms said first, base portion of said organic memory device;
forming a second electrically conductive circuit on said thin layer of polymer material, said second electrically conductive circuit and said corresponding part of said first electrically conductive circuit each comprising a plurality of narrow circuit lines which cross each other at predetermined locations to define points of contact at said locations, said thin layer of organic polymer material and said second electrically conductive circuit forming a second portion of said organic memory device;
forming a second layer of organic dielectric material over said organic memory device;
positioning a first electrical component on said circuitized substrate and electrically coupling said organic memory device through said second layer of organic dielectric material to said first electrical component; and
positioning a second electrical component on said circuitized substrate and electrically coupling said second electrical component to said first electrical component.
18. The method of claim 17 wherein said forming of said first and second electrically conductive circuits is accomplished using photolithographic processing.
19. The method of claim 17 wherein said forming of said thin layer of polymer material is accomplished on said corresponding part of said at least one electrically conductive circuit is accomplished using a process selected from the group of processes consisting of spin coating, roller coating, draw coating, slot coating, curtain coating, printing, lamination, electrostatic deposition, and combinations thereof.
20. The method of claim 17 wherein said forming of said forming of said second layer of organic dielectric material over said organic memory device is accomplished using a lamination process.
21. The method of claim 17 wherein said positioning of said first and second electrical components on said circuitized substrate is accomplished using solder ball connections.
22. The method of claim 17 further including forming an optoelectronic connection structure within said circuitized substrate for electrically coupling said second electrical component to said first electrical component.
23. The method of claim 17 further including forming within said circuitized substrate connecting structure for enabling passage of radio frequency signals between said first and second electrical components.
24. The method of claim 17 further including positioning a heat sinking member on said circuitized substrate for providing heat sinking of said organic memory device.
25. The method of claim 17 further including providing thru-holes within said second layer of organic dielectric material for electrically connecting said organic memory device to said first electrical component.
26. An information handling system comprising:
a housing;
a circuitized substrate positioned substantially within said housing and including a first layer of organic dielectric material and a first electrically conductive circuit formed on said first layer of organic dielectric material, part of said first layer of organic dielectric material and a corresponding part of said first electrically conductive circuit forming a first, base portion of an organic memory device, a thin layer of organic polymer material positioned on said corresponding part of said at least one electrically conductive circuit which forms said first, base portion of said organic memory device, and a second electrically conductive circuit formed on said thin layer of polymer material, said second electrically conductive circuit and said corresponding part of said first electrically conductive circuit each comprising a plurality of narrow circuit lines which cross each other at predetermined locations to define points of contact at said locations, said thin layer of organic polymer material and said second electrically conductive circuit forming a second portion of said organic memory device;
a second layer of organic dielectric material positioned over said organic memory device;
a first electrical component positioned on said circuitized substrate and electrically coupled to said organic memory device through said second layer of organic dielectric material; and
a second electrical component positioned on said circuitized substrate and electrically coupled to said first electrical component.
27. The invention of claim 26 wherein said information handling system comprises a personal computer.
28. The invention of claim 26 wherein said information handling system comprises a mainframe computer.
29. The invention of claim 26 wherein said information handling system comprises a computer server.