Apparatus and methods for constructing antennas using wire bonds as radiating elements
View Patent ↗Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
1. An antenna device, comprising:
a substrate having first and second bond pads formed on a surface of the substrate;
an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the surface of the substrate; and
a metallic shield formed on the surface of the substrate, wherein the metallic shield is disposed between the first and second bond pads on the surface of the substrate and wherein the metallic shield is interposed between the surface of the substrate and at least a portion of the bond wire between the first and second ends thereof.
2. The device of claim 1 , further comprising a dielectric material formed on the surface of the substrate, which encapsulates the at least one bond wire.
3. The device of claim 1 , further comprising a cover formed over the substrate and antenna.
4. The device of claim 1 , wherein the antenna comprises a monopole antenna.
5. The device of claim 1 , wherein the antenna comprises a dipole antenna.
6. The device of claim 1 , wherein the antenna comprises a loop antenna.
7. The device of claim 1 , wherein the antenna comprises an end-fire antenna.
8. The device of claim 1 , wherein the antenna comprises an antenna array.
9. The device of claim 1 , wherein the at least one bond wire comprises a looped portion above the surface of the substrate.
10. The device of claim 9 , wherein the metallic shield is disposed under at least a portion of the looped portion of the bond wire.
11. The device of claim 1 , wherein the substrate further comprises a feed network connected to the antenna.
12. The device of claim 11 , wherein the feed network comprises an impedance matching network.
13. The device of claim 11 , wherein the feed network connects the at least one wire to an integrated circuit of an integrated circuit chip.
14. The device of claim 13 , wherein the integrated circuit comprises a receiver, transmitter or transceiver circuit.
15. An integrated communications device, comprising:
a IC (integrated circuit) chip having first and second bond pads formed on an active surface of the chip;
an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the active surface of the IC chip; and
a metallic shield formed on the active surface of the IC chip, wherein the metallic shield is disposed between the first and second bond pads on the active surface of the chip and wherein the metallic shield is interposed between the active surface of the chip and at least a portion of the bond wire between the first and second ends thereof.
16. The device of claim 15 , further comprising a cover that encapsulates the IC chip and antenna.
17. The device of claim 15 , wherein the IC chip comprises an integrated circuit comprising a transceiver, a receiver, or a transmitter.
18. The device of claim 17 , wherein the IC chip comprises an antenna feed network that connects the at least one bond wire to the integrated circuit.
19. An IC (integrated circuit) package apparatus, comprising:
a carrier substrate;
an IC chip having first and second bond pads formed on an active surface of the chip and having a non-active surface mounted to the carrier substrate;
an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the active surface of the IC chip;
a metallic shield formed on the active surface of the IC, wherein the metallic shield is disposed between the first and second bond pads on the active surface of the chip and wherein the metallic shield is interposed between the active surface of the chip and at least a portion of the bond wire between the first and second ends thereof; and
a package cover that encapsulates the IC chip and antenna.
20. The apparatus of claim 19 , wherein the antenna comprises a monopole antenna.
21. The apparatus of claim 19 , wherein the antenna comprises a dipole antenna.
22. The apparatus of claim 19 , wherein the antenna comprises a loop antenna.
23. The apparatus of claim 19 , wherein the antenna comprises an end-fire antenna array.
24. The apparatus of claim 19 , wherein the antenna comprises an antenna array.
25. The apparatus of claim 19 , wherein the IC chip comprises an integrated circuit comprising a transceiver, a receiver, or a transmitter.
26. The apparatus of claim 25 , wherein the IC chip comprises an antenna feed network that connects the at least one bond wire to the integrated circuit.
27. The apparatus of claim 19 , wherein the antenna comprises at least a second bond wire having a first end bonded on the active surface of the chip and a second end bonded to the carrier substrate.
28. The apparatus of claim 19 , wherein the second end of the at least second bond wire is connected to a lead frame of the carrier substrate.