Projection exposure system
View Patent ↗A projection exposure system, intended in particular for microlithography, is used for generating, in an image plane, an image of a mask arranged in an object plane. The projection exposure system has a light source emitting projection light and projection optics arranged between the mask and the image. Starting from the mask, the following are arranged in the beam path of the projection optics: a first group of optical components with an overall positive refractive power; a second group of optical components with an overall negative refractive power; a third group of optical components with an overall positive refractive power; a fourth group of optical components with an overall negative refractive power, and, a fifth group of optical components with an overall positive refractive power. At least three optical subgroups having at least one optical component can be displaced along the optical axis of the projection optics. The first optical subgroup comprises the mask or at least one optical component from the first group of optical components. The second optical subgroup comprises at least one optical component from the second or the third group of optical components. The third optical subgroup comprises at least one optical component from the third or the fourth group of optical components. With such subgroups, efficient imaging error correction of the projection optics is possible.
1. A system, comprising:
a mask; and
projection optics, comprising:
a first group of optical components with an overall positive refractive power;
a second group of optical components with an overall negative refractive power;
a third group of optical components with an overall positive refractive power;
a fourth group of optical components with an overall negative refractive power; and
a fifth group of optical components with an overall positive refractive power,
wherein the mask and the groups of optical components comprise:
at least a first, second and third optical subgroup each having at least one optical component that can be displaced along an optical axis of the projection optics, wherein
the first optical subgroup comprises the mask and at least one optical component from the first group of optical components,
the second optical subgroup comprises at least one optical component from the second and third group of optical components, and
the third optical subgroup comprises at least one optical component from the third and fourth group of optical components, and
wherein the system is a microlithography projection exposure system.
2. The system according to claim 1 , wherein the second optical subgroup is arranged next to the first group of optical components.
3. The system according to claim 1 , wherein the third optical subgroup is arranged in a transition region between the third and fourth groups of optical components.
4. The system according to claim 1 , wherein a pair of optical components, whose displacements along the optical axis are expediently coupled together, is provided as the second optical subgroup.
5. The system according to claim 4 , wherein that a support body is provided, which can be displaced along the optical axis of the projection optics and which supports the pair of optical components together.
6. The system according to claim 1 , wherein an instrument for adjusting a wavelength of the projection light emitted by a light source is provided.
7. The system according to claim 6 , wherein the adjustment instrument includes means for altering the wavelength of the projection light emitted by the light source.
8. The system according to claim 6 , wherein the adjustment instrument includes means for altering the wavelength of the projection light emitted by the light source after exiting the light source.
9. The system according to claim 1 , comprising at least one further optical subgroup, having at least one optical component, which can be displaced along the optical axis of the projection optics and which comprises at least one optical component from the fifth group of optical components.
10. The system according to claim 1 , comprising an at most fourth and fifth optical subgroup which can be displaced along the optical axis of projection optics.
11. The system according to claim 1 , wherein the optical components are designed as refractive components.
12. A system, comprising:
a mask; and
projection optics, comprising:
a first group of optical components with an overall positive refractive power;
a second group of optical components with an overall negative refractive power;
a third group of optical components with an overall positive refractive power;
a fourth group of optical components with an overall negative refractive power; and
a fifth group of optical components with an overall positive refractive power, wherein the mask and the groups of optical components comprise:
at least a first and second optical subgroup, the first and second optical subgroups each having at least one optical component that can be displaced along an optical axis of the projection optics, and
wherein:
during use, light passes through the system along an optical path;
the second group of optical components is between the first group of optical components and the third group of optical components along the optical path;
the third group of optical components is between the second group of optical components and the fourth group of optical components along the optical path;
the fourth group of optical components is between the third group of optical components and the fifth group of optical components along the optical path;
the first optical subgroup comprises the mask and at least one optical component from the first group of optical components;
the second optical subgroup comprises at least one optical component from the second and third group of optical components; and
the system is a microlithography projection exposure system.
13. A system, comprising:
a mask; and
projection optics, comprising:
a first group of optical components with an overall positive refractive power;
a second group of optical components with an overall negative refractive power;
a third group of optical components with an overall positive refractive power;
a fourth group of optical components with an overall negative refractive power; and
a fifth group of optical components with an overall positive refractive power, wherein the mask and the groups of optical components comprise:
at least a first and second optical subgroup, the first and second optical subgroups each having at least one optical component that can be displaced along an optical axis of the projection optics, and
wherein:
during use, light passes through the system along an optical path;
the second group of optical components is between the first group of optical components and the third group of optical components along the optical path;
the third group of optical components is between the second group of optical components and the fourth group of optical components along the optical path;
the fourth group of optical components is between the third group of optical components and the fifth group of optical components along the optical path;
the first optical subgroup comprises at least one optical component from the second and third group of optical components;
the second optical subgroup comprises at least one optical component from the third and fourth group of optical components; and
the system is a microlithography projection exposure system.
14. A system, comprising:
a mask; and
projection optics, comprising:
a first group of optical components with an overall positive refractive power;
a second group of optical components with an overall negative refractive power;
a third group of optical components with an overall positive refractive power;
a fourth group of optical components with an overall negative refractive power; and
and a fifth group of optical components with an overall positive refractive power, wherein the mask and the groups of optical components comprise:
at least a first and second optical subgroup, the first and second optical subgroups each having at least one optical component that can be displaced along an optical axis of the projection optics,
wherein:
during use, light passes through the system along an optical path;
the second group of optical components is between the first group of optical components and the third group of optical components along the optical path;
the third group of optical components is between the second group of optical components and the fourth group of optical components along the optical path;
the fourth group of optical components is between the third group of optical components and the fifth group of optical components along the optical path;
the first optical subgroup comprises the mask and at least one optical component from the first group of optical components;
the second optical subgroup comprises at least one optical component from the third and fourth group of optical components; and
the system is a microlithography projection exposure system.