Integrated circuit system with a debris trapping system
An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer; removing material from the backside of the integrated circuit wafer; and dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die.
1. An integrated circuit system comprising:
providing an integrated circuit wafer having an integrated circuit side and a backside;
mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer;
removing material from the backside of the integrated circuit wafer;
dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die; and
rolling a rolling system directly on the protective adhesive for removing the protective adhesive from the integrated circuit die.
2. The system as claimed in claim 1 wherein:
the mounting includes bonding the protective adhesive to the integrated circuit wafer.
3. The system as claimed in claim 1 further comprising:
removing the protective adhesive after dicing.
4. The system as claimed in claim 1 further comprising:
attaching the integrated circuit die with the protective adhesive mounted thereto to a substrate; and
removing the protective adhesive after attaching.
5. The system as claimed in claim 1 wherein:
the mounting the protective adhesive uses a transparent material.
6. An integrated circuit system comprising:
providing an integrated circuit wafer having an integrated circuit side and a backside;
bonding a protective adhesive tape on the integrated circuit side of the integrated circuit wafer;
preparing the integrated circuit wafer for grinding the backside thereof;
grinding material from the backside of the integrated circuit wafer;
preparing the integrated circuit wafer for dicing;
dicing the integrated circuit wafer through the protective adhesive tape to form an integrated circuit die; and
rolling a rolling system directly on the protective adhesive for removing the protective adhesive from the integrated circuit die including removing debris, formed by dicing the integrated circuit wafer, with the protective adhesive tape.
7. The system as claimed in claim 6 wherein:
the bonding laminates the protective adhesive tape under pressure.
8. The system as claimed in claim 6 further comprising:
removing the protective adhesive tape after dicing and before die attach.
9. The system as claimed in claim 6 further comprising:
attaching the integrated circuit die with the protective adhesive tape attached thereto to a substrate; and
removing the protective adhesive tape after attaching using the rolling system.
10. The system as claimed in claim 6 wherein the laminating process uses a transparent protective adhesive tape for dicing by a laser.
11. An integrated circuit system comprising:
a dicing debris trapping system for mounting a protective adhesive on an integrated circuit side of an integrated circuit wafer having an integrated circuit wafer having an integrated circuit side and a backside;
a system for removing material from the backside of the integrated circuit wafer;
a dicing system for dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die and
a rolling system for removing the protective adhesive from the integrated circuit die by rolling directly on the protective adhesive.
12. The system as claimed in claim 11 wherein:
the dicing debris trapping system is for bonding the protective adhesive to the integrated circuit wafer.
13. The system as claimed in claim 11 further comprising:
the rolling system is for removing the protective adhesive after dicing.
14. The system as claimed in claim 11 further comprising:
a pick-and-place system for attaching the integrated circuit die with the protective adhesive mounted thereto to a substrate; and
the rolling system for removing the protective adhesive after attaching.
15. The system as claimed in claim 11 wherein:
the dicing debris trapping system is for the mounting a transparent protective adhesive.
16. The system as claimed in claim 11 wherein:
the dicing debris trapping system is for bonding a protective adhesive tape on an integrated circuit side of an integrated circuit wafer having an integrated circuit side and a backside;
the system for removing material includes a system for preparing the integrated circuit wafer for grinding the backside thereof, the system for removing material is a grinding system for grinding material from the backside of the integrated circuit wafer;
the dicing system includes a system for preparing the integrated circuit wafer for dicing, the dicing system is for dicing the integrated circuit wafer through the protective adhesive tape to form an integrated circuit die; and
the rolling system for removing the protective adhesive tape includes debris, formed by the integrated circuit wafer diced, removed with the protective adhesive tape.
17. The system as claimed in claim 16 wherein:
the dicing debris trapping system is for laminating the protective adhesive tape to the integrated circuit wafer under pressure.
18. The system as claimed in claim 16 wherein:
the rolling system is for removing the protective adhesive tape after dicing and before die attach.
19. The system as claimed in claim 16 wherein:
the rolling system is for removing the protective adhesive tape after die attach.
20. The system as claimed in claim 16 wherein the dicing debris trapping system uses a transparent protective adhesive tape for dicing by a laser.