Semiconductor package system with die support pad
A semiconductor package system includes: providing a lead frame with a lead; making a die support pad separately from the lead frame; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead; and connecting a bonding pad on the semiconductor die to the lead using a bonding wire.
1. A semiconductor package system comprising:
leads adjacent to a peripheral edge;
a die support pad, formed without tiebars, made separately from the leads includes a bottom surface of the die support pad coplanar with the bottom surface of the leads;
a semiconductor die attached to the die support pad through a die adhesive; and
a bonding wire connecting a bonding pad on the semiconductor die to one of the leads.
2. The system as claimed in claim 1 wherein the semiconductor die overhangs the leads.
3. The system as claimed in claim 1 wherein the die support pad is pre-coated with the die attach adhesive.
4. The system as claimed in claim 1 wherein the semiconductor die is spaced from the leads.
5. The system as claimed in claim 1 wherein the die support pad has a die support pad groove formed at the bottom surface of the die support pad.
6. The system as claimed in claim 1 further comprising:
a mold compound encapsulating the semiconductor die, the bonding pad, the bonding wire, the die attach adhesive, and the die support pad.
7. The system as claimed in claim 6 wherein the semiconductor die, having the bonding pad thereon, is pre-coated with the die attach adhesive.
8. The system as claimed in claim 6 wherein a space between the semiconductor die and the leads is filled with the die attach adhesive.
9. The system as claimed in claim 6 wherein the die support pad is pre-plated with NiPd.
10. The system as claimed in claim 6 wherein the lead frame with a lead has corner leads adjacent to each other without an intervening portion of the leadframe.