Integrated circuit packaging system having planar interconnect

1. An integrated circuit package system comprising:

a carrier;

an integrated circuit, having a planar interconnect, over the carrier with the planar interconnect, at a non-active side of the integrated circuit, connected to the carrier and an active side of the integrated circuit facing and connected to the carrier;

a mounting interconnect over the planar interconnect; and

an encapsulation over the integrated circuit, the carrier, and the planar interconnect, the encapsulation having a cavity with the mounting interconnect exposed with the cavity.

2. The system as claimed in claim 1 wherein the encapsulation includes a cavity with the planar interconnect exposed by the cavity.

3. The system as claimed in claim 1 wherein the carrier includes the carrier having an opening with the active side and the carrier connected through the opening.

4. The system as claimed in claim 1 further comprising a mounting interconnect over the planar interconnect and exposed from the encapsulation.

5. The system as claimed in claim 1 further comprising:

an adhesive between the integrated circuit and the carrier; and

a package interconnect below the carrier.

6. The system as claimed in claim 5 further comprising:

a first interconnect between the active side and the carrier through an opening of the carrier; and

wherein the encapsulation includes:

the encapsulation through the opening for covering the first interconnect.

7. The system as claimed in claim 5 further comprising a mounting device over the planar interconnect.

8. The system as claimed in claim 5 further comprising a mounting interposer over the planar interconnect.

9. The system as claimed in claim 5 further comprising a device interconnect between the active side and the carrier with the device interconnect over the carrier.