Integrated circuit package system with heat slug

1. An integrated circuit package system comprising:

a substrate;

a plurality of dies attached to the substrate and electrically bonded thereto;

heat slug pillars on the substrate only around a periphery of the plurality of dies;

a heat slug on the heat slug pillars; and

a mold compound encapsulating the die and the heat slug pillars between the substrate and the heat slug wherein the die and the heat slug pillars are encapsulated in the mold compound for a package without the heat slug pillars.

2. The system as claimed in claim 1 wherein the heat slug includes indentations provided therein for heat dissipation thereby.

3. The system as claimed in claim 1 wherein the heat slug has a groove around the periphery thereof inside the heat slug pillars.

4. The system as claimed in claim 1 wherein the heat slug includes the heat slug with lines for individual heat slugs connected by tie bars.

5. The system as claimed in claim 1 further comprising:

electrical bonds for electrically bonding dies to the substrate;

pillars of adhesive for forming heat slug pillars around the periphery of the substrate;

placing a heat slug on the pillars of adhesive; and

solder balls on the substrate electrically connected to the dies.

6. The system as claimed in claim 5 wherein the heat slug is above the dies and electrical bonds.

7. The system as claimed in claim 5 wherein the heat slug has indentions provided therein.

8. The system as claimed in claim 5 wherein placing the heat slug includes a groove around the periphery thereof inside the heat slug pillars and out side the electrical bonds when positioned.

9. The system as claimed in claim 5 wherein the heat slug has full-etched lines for individual heat slugs connected by tie bars.