Integrated circuit package system with offset stacking

1. A method for manufacturing an integrated circuit package system comprising:

providing an interposer having a bond pad and a contact pad on a first side and further having a second side;

mounting the interposer in an offset location over a carrier with the second side of the interposer coplanar with an edge of the carrier for mounting a mounting device thereover;

connecting an electrical interconnect between bond pad and the carrier;

forming an anti-flash structure over a portion of the electrical interconnect over the bond pad; and

forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad on the first side and the second side of the interposer not covered by the package encapsulation as well as the anti-flash structure being exposed at a peripheral side of the package encapsulation.

2. The method as claimed in claim 1 wherein mounting the interposer includes mounting a second integrated circuit device having the interposer.

3. The method as claimed in claim 1 wherein:

providing the interposer includes:

providing a composite interposer having the interposer; and

mounting the interposer in the offset location over the carrier includes:

mounting a composite interposer having the interposer over a composite carrier having the carrier.

4. The method as claimed in claim 1 , wherein forming the anti-flash structure over a portion of the electrical interconnect over the bond pad includes exposing the anti-flash structure on two adjacent peripheral sides of the package encapsulation.

5. The method as claimed in claim 1 further comprising mounting a first integrated circuit device over the carrier.

6. A method for manufacturing an integrated circuit package system comprising:

providing an interposer having a bond pad and a contact pad on a first side and further having a second side;

mounting the interposer in an offset location over a carrier with the second side of the interposer coplanar with an edge of the carrier;

mounting a first integrated circuit device over the carrier;

mounting a passive device over the carrier;

connecting an electrical interconnect between bond pad and the carrier;

forming an anti-flash structure over a portion of the electrical interconnect over the bond pad; and

forming a package encapsulation over the carrier, the electrical interconnect, the passive device, and the first integrated circuit device with both the contact pad on the first side and the second side of the interposer not covered by the package encapsulation as well as the anti-flash structure being exposed at a peripheral side of the package encapsulation.

7. The method as claimed in claim 6 wherein mounting the interposer includes mounting a second integrated circuit device having the interposer with the second side of the interposer on the same coplanar side of the second integrated circuit device.

8. The method as claimed in claim 6 wherein mounting the interposer in the offset location over the carrier with the second side of the interposer coplanar with the edge of the carrier includes mounting the interposer at a corner of the carrier with exposed sides of the interposer coplanar with edges of the carrier.

9. The method as claimed in claim 6 wherein mounting the interposer in the offset location over the carrier with the second side of the interposer coplanar with the edge of the carrier includes mounting interposers over the carrier with the second side of each of the interposers coplanar with edge of the carrier.

10. The method as claimed in claim 6 further comprising mounting a mounting device over the interposer.

11. An integrated circuit package system comprising:

a carrier;

an interposer, having a bond pad and a contact pad on a first side and further having a second side, and the interposer is in an offset location over the carrier with the second side of the interposer coplanar with an edge of the carrier for mounting a mounting device thereover;

an anti-flash structure over a portion of the electrical interconnect over the bond pad; and

an electrical interconnect between bond pad and the carrier;

a package encapsulation over the carrier and the electrical interconnect with both the contact pad on the first side and the second side of the interposer not covered by the package encapsulation as well as the anti-flash structure being exposed at a peripheral side of the package encapsulation.

12. The system as claimed in claim 11 wherein the interposer is included in a second integrated circuit device.

13. The system as claimed in claim 11 wherein:

the interposer is included in a composite interposer; and

the carrier is included in a composite carrier having the composite interposer mounted thereover.

14. The system as claimed in claim 11 , wherein the anti-flash structure over a portion of the electrical interconnect over the bond pad includes the anti-flash structure exposed on adjacent peripheral sides of the package encapsulation.

15. The system as claimed in claim 11 further comprising a first integrated circuit device over the carrier.

16. The system as claimed in claim 11 further comprising:

a first integrated circuit device over the carrier;

a passive device over the carrier; and

wherein the package encapsulation is over the passive device and the first integrated circuit device.

17. The system as claimed in claim 16 wherein the interposer is included in a second integrated circuit device having the interposer with the second side of the interposer on the same coplanar side of the second integrated circuit device.

18. The system as claimed in claim 16 wherein the interposer is at a corner of the carrier with exposed sides of the interposer coplanar with edges of the carrier.

19. The system as claimed in claim 16 wherein the interposer includes interposers over the carrier with the second side of each of the interposers coplanar with edge of the carrier.

20. The system as claimed in claim 16 further comprising a mounting device over the interposer.