IP Library Granted Patent US 8,260,446
Granted Patent B2
US 8,260,446 · App. 12/699,014 · Granted Sep 4, 2012

Spectrographic monitoring of a substrate during processing using index values

Assignee: Applied Materials, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,260,446
App. No.
12/699,014
Granted
Sep 4, 2012
Kind
B2
Abstract

Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Claims (16)

1. A computer-implemented method, comprising:

storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, each index value representing a time during a polishing operation at which the reference spectrum of the plurality of reference spectra with the associated index value is expected to be observed;

measuring a sequence of spectra in-situ during polishing of a substrate to obtain measured spectra, wherein each stored associated index value was generated prior to polishing of the substrate;

binning spectra from the measured spectra into two or more radial zones;

for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum from the plurality of reference spectra to generate a sequence of best matching reference spectra;

determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values;

fitting a linear function to the sequence of index values; and

halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index,

wherein the steps of finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining an associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values and fitting a linear function to the sequence of index values are performed for each of the two or more radial zones independently of one another.

2. The method of claim 1 , wherein a first of the two or more radial zones is an inner zone and a second of the two or more radial zones is an annular zone.

3. The method of claim 1 , further comprising adjusting a polishing rate in at least one radial zone of the two or more radial zones.

4. The method of claim 3 , wherein adjusting the polishing rate comprises causing an endpoint to occur when an entirety of the substrate has a flat surface.

5. The method of claim 1 , wherein determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values includes determining associated index values from two different libraries of reference spectra to generate two corresponding sequences of index values.

6. The method of claim 5 , wherein fitting a linear function to the sequence of index values includes fitting a linear function to each sequence of index values that corresponds to each library to obtain two different linear functions, the method further comprising:

for each zone, determining which of the linear functions has a better goodness of fit to the corresponding sequence of index values.

7. The method of claim 6 , wherein halting polishing includes halting polishing when the linear function with the better goodness of fit to the index trace for each zone matches or exceeds the target index value.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2010
From: DAVID, JEFFREY DRUE; BENVEGNU, DOMINIC J; LEE, HARRY Q; SWEDEK, BOGUSLAW A; KARUPPIAH, LAKSHMANAN
To: APPLIED MATERIALS, INC.
Reel/Frame 024274/0001 →
Continuity (11)
Continuation In Part 12185719 · Aug 4, 2008
Continuation 11748825 · May 15, 2007
Continuation 12699014
Continuation In Part 12182076 · Jul 29, 2008
Division 11261742 · Oct 28, 2005
Continuation In Part 11213344 · Aug 26, 2005
Continuation In Part 12699014
Continuation In Part 12258923 · Oct 27, 2008
Provisional Application 60747768 · May 19, 2006
Provisional Application 60710682 · Aug 22, 2005
Related Publication 20100217430A1 · Aug 26, 2010