Substrate processing apparatus, substrate annealing method, and semiconductor device manufacturing method

1. A substrate processing apparatus comprising:

a chamber capable of being evacuated;

a substrate stage adapted to, in the chamber, mount a substrate;

a heating unit adapted to, in the chamber, be set above a substrate mounting surface of the substrate stage, face the substrate mounted on at least the substrate mounting surface, and heat the substrate by radiant heat without being in contact with the substrate;

a shutter adapted to, in the chamber, be retractably inserted in a space between the heating unit and the substrate mounted on the substrate mounting surface; and

a shutter driving unit adapted to, in the chamber, extend/retract the shutter into/from the space,

wherein the shutter has a first principal surface serving as a heat reflecting surface, and a second principal surface serving as a heat absorbing surface,

wherein the shutter is disposed such that said first principal surface faces the heating unit and said second principal surface faces the substrate stage when the shutter extends into the space, and

wherein the shutter includes a first cooling unit adapted to have an outer periphery surrounded by a sealing member.

2. The apparatus according to claim 1 , further comprising:

a driving unit adapted to, in the chamber, lift the substrate stage toward the heating unit in heating the substrate and lower the substrate stage after heating the substrate.

3. A substrate processing apparatus comprising:

a chamber capable of being evacuated;

a substrate stage adapted to, in the chamber, mount a substrate;

a heating unit adapted to, in the chamber, be set above a substrate mounting surface of the substrate stage, face the substrate mounted on at least the substrate mounting surface, and heat the substrate by radiant heat without being in contact with the substrate;

a shutter adapted to, in the chamber, be retractably inserted in a space between the heating unit and the substrate mounted on the substrate mounting surface; and

a shutter driving unit adapted to, in the chamber, extend/retract the shutter into/from the space;

wherein the shutter has a first principal surface serving as a heat reflecting surface, and a second principal surface serving as a heat absorbing surface,

wherein the shutter is disposed such that said first principal surface faces the heating unit and said second principal surface faces the substrate stage when the shutter extends into the space,

wherein the shutter includes a first cooling unit adapted to have an outer periphery surrounded by a sealing member, and

wherein the substrate stage includes a second cooling unit adapted to be positioned on a side opposite to a side on which the heating unit is disposed with respect to the substrate stage.

4. The apparatus according to claim 3 , further comprising:

a heat storage unit adapted to, in the chamber, be positioned on a side opposite to a side on which the heating unit is disposed with respect to the substrate stage,

wherein said heat storage unit is inserted between the substrate storage stage and said second cooling unit.

5. A substrate annealing method, the method comprising the steps of:

(a) mounting a substrate on a substrate stage to face a heating unit;

(b) annealing the substrate, mounted on the substrate stage, by heating the substrate by radiant heat from the heating unit; and

(c) extending a shutter, having a surface that faces the substrate stage and is cooled, into the space between the heating unit and the substrate stage after the substrate undergoes the annealing.

6. The method according to claim 5 , further comprising:

(i) lifting the substrate stage toward the heating unit after the substrate is mounted on the substrate stage in the mounting step; and

(ii) lowering the substrate stage with respect to the heating unit after the substrate is heated and undergoes the annealing in the annealing step,

wherein in the extending step, the shutter, having a surface that faces the substrate stage and is cooled using water, is extended after the lowering of the substrate stage is completed in the lowering step.

7. A semiconductor device manufacturing method comprising:

a step of annealing a substrate using a substrate annealing method defined in claim 5 .