IP Library Granted Patent US 8,553,098
Granted Patent B2
US 8,553,098 · App. 12/323,755 · Granted Oct 8, 2013

Semiconductor device and imaging capturing apparatus

Inventor: Tomofumi Watanabe (Gifu, JP)
Assignees: Sanyo Semiconductor Co., Ltd.; Semiconductor Components Industries, LLC
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Quick Facts
Patent No.
US 8,553,098
App. No.
12/323,755
Granted
Oct 8, 2013
Kind
B2
Abstract

A semiconductor device with an “anti-shake” function includes a logic chip having a digital circuit which obtains a value indicating the amount of vibration of device such as an imaging apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The control signal output unit includes a plurality of types of signal output sections and outputs a vibration control signal corresponding to a driving unit from one signal output section selected from among the plurality of types of signal output sections.

Claims (35)

1. A semiconductor device having an anti-shake function, comprising:

a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal,

the logic chip including:

a correction signal processing unit which generates the correction signal; and

a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration,

wherein the control signal output unit includes a plurality of types of signal output sections and outputs the vibration control signal corresponding to a driving unit which drives the optical component from one signal output section which is selected from among the plurality of types of signal output sections;

wherein the semiconductor device further comprises a plurality of switches with each switch of the plurality of switches being configured to selectively provide the correction signal from the correction signal processing unit to only one of the plurality of types of signal output sections.

2. The semiconductor device according to claim 1 , wherein

the vibration correction control unit controls the driving unit which controls a position of a lens or an image sensor, which is the optical component, in accordance with the apparatus vibration value.

3. The semiconductor device according to claim 1 , wherein

the plurality of types of signal output sections include at least two types of signal output sections among a voice coil motor control signal output section, a stepping motor control signal output section, and a piezo element control signal output section.

4. The semiconductor device according to claim 1 , wherein

the plurality of types of signal output sections are provided corresponding to a plurality of types of vibration correction control sections which can be adopted as the vibration correction control unit which executes vibration correction control for the optical component.

5. The semiconductor device according to claim 1 , wherein

the logic chip and a driver chip which includes an analog circuit are contained in a common substrate and sealed in a single package, and

the driver chip includes the vibration correction control unit for an anti-shake function in the apparatus in which the semiconductor device is mounted.

6. An image capturing apparatus comprising:

a lens;

an image sensor;

a driving unit for driving the lens or the image sensor;

a vibration detection element for detecting vibration of the apparatus; and

a semiconductor device having an anti-shake function, wherein

the semiconductor device includes a logic chip having a digital circuit which obtains a value for vibration of the image capturing apparatus based on a vibration detection signal supplied from the vibration detection element to generate a correction signal,

the logic chip having:

a correction signal processing unit which generates the correction signal; and

a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for the lens or the image sensor in accordance with vibration,

the control signal output unit including a plurality of types of signal output sections and outputting the vibration control signal corresponding to the driving unit from one signal output section which is selected from among the plurality of types of signal output sections;

wherein the semiconductor device further comprises a plurality of switches with each switch of the plurality of switches being configured to selectively provide the correction signal from the correction signal processing unit to only one of the plurality of types of signal output sections.

7. The image capturing apparatus according to claim 6 , wherein

the plurality of types of signal output sections of the semiconductor device include at least two types of signal output sections among a voice coil motor control signal output section, a stepping motor control signal output section, and a piezo element control signal output section.

8. The image capturing apparatus according to claim 6 , wherein

the plurality of types of signal output sections of the semiconductor device are provided corresponding to a plurality of types of vibration correction control sections which can be adopted as the vibration correction control unit.

9. The image capturing apparatus according to claim 6 , wherein

the logic chip of the semiconductor device and a driver chip including an analog circuit are contained in a common substrate and sealed in a single package, and

the driver chip includes the vibration correction control unit for an anti-shake function in the image capturing apparatus in which the semiconductor device is mounted.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2013
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 031729/0866 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2011
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 026594/0385 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED ON REEL 022256 FRAME 0589. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE ADDRESS SHOULD READ 2-CHOME, NOT 2-COME AS PREVIOUSLY SUBMITTED. Recorded Mar 11, 2009
From: WATANABE, TOMOFUMI
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 022377/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2009
From: WATANABE, TOMOFUMI
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 022256/0589 →
Priority Claims (2)
JP 2007-307697 · Nov 28, 2007 · national
JP 2008-244570 · Sep 24, 2008 · national
Continuity (1)
Related Publication 20090141136A1 · Jun 4, 2009