IP Library Granted Patent US 8,564,676
Granted Patent B2
US 8,564,676 · App. 12/323,884 · Granted Oct 22, 2013

Semiconductor device with anti-shake control function

Inventors: Tomofumi Watanabe (Gifu, JP); Hideki Hirayama (Gifu, JP)
Assignees: Sanyo Semiconductor Co., Ltd.; Semiconductor Components Industries, LLC
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Quick Facts
Patent No.
US 8,564,676
App. No.
12/323,884
Granted
Oct 22, 2013
Kind
B2
Abstract

A semiconductor device with an anti-shake function includes a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration. The correction signal processing unit includes a vibration computing unit which is capable of executing a plurality of stages of signal processing operations, by dedicated circuits, respectively, and which generates the correction signal from the vibration detection signal, and a central processing unit capable of executing desired computation processing to be performed by the vibration computing unit, and a signal obtained by executing all or a part of the computation processing to be performed by the dedicated circuits by the central processing unit is supplied as the correction signal to the control signal output unit.

Claims (52)

1. A semiconductor device having an anti-shake function, comprising:

a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal,

the logic chip including:

a correction signal processing unit which generates the correction signal; and

a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration,

the correction signal processing unit having:

a vibration computing unit which is capable of executing a plurality of stages of signal processing operations by dedicated circuits, respectively, and which generates the correction signal from the vibration detection signal, and

a central processing unit capable of executing desired computation processing to be performed by the vibration computing unit,

wherein a signal obtained by executing all or a part of the computation processing to be performed by the dedicated circuits by the central processing unit is supplied as the correction signal to the control signal output unit;

wherein the dedicated circuits are configured to perform predetermined computations that cannot be changed;

wherein the desired computation processing of the central processing unit can be changed; and

wherein the semiconductor device further comprises:

a selection switch unit capable of selecting between an output of the vibration computing unit and an output of the central processing unit; and

a switch unit which supplies a computation result obtained by the central processing unit, in place of a computation result obtained by the dedicated circuit, the computation processing of which is to be performed by the central processing unit, to another dedicated circuit which executes computation processing; and

wherein the central processing unit and the dedicated circuits are different structures; and

wherein the dedicated circuits are provided in series and the CPU is configured to perform one of the predetermined computations of the dedicated circuits based on a state of the switch unit.

2. The semiconductor device according to claim 1 , wherein

the vibration correction control unit controls a driving unit which controls a position of a lens or an image sensor, which is the optical component, in accordance with the value for vibration of the apparatus.

3. The semiconductor device according to claim 1 , wherein

the control signal output unit includes a plurality of types of signal output sections capable of respectively outputting the vibration control signal corresponding to a plurality of types of vibration correction control sections which can be adopted as the vibration correction control unit which executes vibration correction control for the optical component.

4. The semiconductor device according to claim 1 , wherein

the logic chip and a driver chip which includes an analog circuit are contained in a common substrate and sealed in a single package, and

the driver chip includes the vibration correction control unit for an anti-shake function in an apparatus in which the semiconductor device is mounted.

5. An image capturing apparatus comprising:

a lens;

an image sensor;

a driving unit for driving the lens or the image sensor;

a vibration detection element for detecting vibration of the apparatus; and

a semiconductor device having an anti-shake function, wherein the semiconductor device includes:

a logic chip having a digital circuit which obtains a value for vibration of the image capturing apparatus based on a vibration detection signal supplied from the vibration detection element to generate a correction signal,

the logic chip of the semiconductor device including:

a correction signal processing unit which generates the correction signal; and

a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for the lens or the image sensor in accordance with vibration,

the correction signal processing unit of the semiconductor device having:

a vibration computing unit which is capable of executing a plurality of stages of signal processing operations, by dedicated circuits, respectively, and which generates the correction signal from the vibration detection signal, and

a central processing unit capable of executing desired computation processing to be performed by the signal processing circuit unit,

a signal obtained by executing all or a part of the computation processing to be performed by the dedicated circuits by the central processing unit being supplied as the correction signal to the control signal output unit;

wherein the dedicated circuits are configured to perform predetermined computations that cannot be changed;

wherein the desired computation processing of the central processing unit can be changed; and

wherein the semiconductor device further comprises:

a selection switch unit capable of selecting between an output of the vibration computing unit and an output of the central processing unit; and

a switch unit which supplies a computation result obtained by the central processing unit, in place of a computation result obtained by the dedicated circuit, the computation processing of which is to be performed by the central processing unit, to another dedicated circuit which executes computation processing, and

wherein the central processing unit and the dedicated circuits are different structures; and

wherein the dedicated circuits are provided in series and the CPU is configured to perform one of the predetermined computations of the dedicated circuits based on a state of the switch unit.

6. The image capturing apparatus according to claim 5 , comprising:

a selection switch unit capable of selecting between an output of the vibration computing unit and an output of the central processing unit; and

a switch unit which supplies a computation result obtained by the central processing unit, in place of a computation result obtained by the dedicated circuit, the computation processing of which is to be performed by the central processing unit, to another dedicated circuit which executes computation processing.

7. The image capturing apparatus according to claim 5 , wherein

the control signal output unit includes a plurality of types of signal output sections capable of respectively outputting the vibration control signal corresponding to a plurality of types of vibration correction control sections which can be adopted as the vibration correction control unit.

8. The image capturing apparatus according to claim 5 , wherein

the logic chip of the semiconductor device and a driver chip which includes an analog circuit are contained in a common substrate and sealed in a single package, and

the driver chip includes the vibration correction control unit for an anti-shake function in the image capturing apparatus.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2013
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 031729/0866 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2011
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 026594/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2009
From: WATANABE, TOMOFUMI; HIRAYAMA, HIDEKI
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 022286/0525 →
Priority Claims (2)
JP 2007-307700 · Nov 28, 2007 · national
JP 2008-277138 · Oct 28, 2008 · national
Continuity (1)
Related Publication 20090141133A1 · Jun 4, 2009