Metal gate stack formation for replacement gate technology
Generally, the subject matter disclosed herein relates to modern sophisticated semiconductor devices and methods for forming the same, wherein a reduced threshold voltage (V t ) may be achieved in HK/MG transistor elements that are manufactured based on replacement gate electrode integrations. One illustrative method disclosed herein includes forming a first metal gate electrode material layer above a gate dielectric material layer having a dielectric constant of approximately 10 or greater. The method further includes exposing the first metal gate electrode material layer to an oxygen diffusion process, forming a second metal gate electrode material layer above the first metal gate electrode material layer, and adjusting an oxygen concentration gradient and a nitrogen concentration gradient in at least the first metal gate electrode material layer and the gate dielectric material layer.
1. A method, comprising:
forming a first metal gate electrode material layer above a gate dielectric material layer having a dielectric constant of approximately 10 or greater;
exposing said first metal gate electrode material layer to an oxygen diffusion process;
forming a second metal gate electrode material layer above said first metal gate electrode material layer; and
adjusting an oxygen concentration gradient and a nitrogen concentration gradient in at least said first metal gate electrode material layer and said gate dielectric material layer.
2. The method of claim 1 , wherein exposing said first metal gate electrode material layer to an oxygen diffusion process comprises exposing said first metal gate electrode material to an atmospheric ambient comprising approximately 20-22% oxygen.
3. The method of claim 2 , wherein said first metal gate electrode material is exposed to said atmospheric ambient at a temperature of approximately 15-25° C. for a time of approximately 20 hours or greater.
4. The method of claim 3 , wherein said first metal gate electrode material is exposed to said atmospheric ambient at a temperature of approximately 20° C. for a time of approximately 24 hours.
5. The method of claim 2 , wherein said first metal gate electrode material is exposed to said atmospheric ambient at a temperature of approximately 150-200° C. for a time of approximately 60 minutes or less.
6. The method of claim 5 , wherein said first metal gate electrode material is exposed to said atmospheric ambient at a temperature of approximately 150° C. for a time of approximately 30 minutes.
7. The method of claim 1 , wherein adjusting said oxygen and nitrogen concentration gradients comprises adjusting said oxygen and nitrogen concentration gradients proximate an interface between said first metal gate electrode material and said gate dielectric material layer.
8. The method of claim 1 , wherein adjusting said oxygen and nitrogen concentration gradients comprises exposing at least said first metal gate electrode material layer and said gate dielectric material layer to a thermal treatment.
9. The method of claim 8 , wherein said thermal treatment is performed in a substantially oxygen-free ambient at a temperature less than approximately 400° C. and for a time of less than approximately 10 minutes.
10. The method of claim 9 , wherein said thermal treatment is performed at a temperature of approximately 300° C. and for a time of approximately 5 minutes.
11. The method of claim 1 , wherein said second metal gate electrode material layer is formed after exposing said first metal gate electrode material layer to said oxygen diffusion process and before adjusting said oxygen and nitrogen concentration gradients.
12. The method of claim 1 , wherein forming said second metal gate electrode material layer comprises forming said second metal gate electrode material layer that has a material composition that is substantially the same as a material composition of said first metal gate electrode material layer.
13. The method of claim 12 , wherein forming each of said first and second metal gate electrode material layers comprises forming a material layer substantially comprising titanium nitride.
14. The method of claim 1 , wherein forming said second metal gate electrode material layer comprises forming said second metal gate electrode material layer having a material composition with a nitrogen content that is higher than a nitrogen content of said first metal gate electrode material layer.
15. The method of claim 1 , wherein forming said second metal gate electrode material layer comprises forming said second metal gate electrode material layer that has a material composition that is substantially different than a material composition of said first metal gate electrode material layer.
16. The method of claim 15 , wherein forming said first metal gate electrode material layer comprises forming a material layer substantially comprising titanium nitride, and wherein forming said second metal gate electrode material layer comprises forming a material layer substantially comprising titanium.
17. The method of claim 16 , wherein forming said second metal gate electrode material layer comprises performing a nitridization process to implant nitrogen atoms into an upper surface of said second metal gate electrode material layer.
18. The method of claim 1 , wherein forming said first metal gate electrode material layer comprises forming a first metal sub-layer and a second metal sub-layer, said second metal sub-layer having a different material composition than said first metal sub-layer.
19. The method of claim 18 , wherein forming said first metal sub-layer comprises forming a material layer substantially comprising titanium nitride, and wherein forming said second metal sub-layer comprises forming a material layer substantially comprising titanium.
20. A method, comprising:
forming a gate dielectric layer of a PMOS transistor element above an interfacial layer formed above an active region of a semiconductor device, said gate dielectric layer comprising a high-k dielectric material having a dielectric constant of approximately 10 or greater;
forming a first layer of metal gate electrode material on said gate dielectric layer;
exposing said first layer of metal gate electrode material to an oxygen diffusion process at a temperature less than approximately 200° C.;
forming a second layer of metal gate electrode material on said first layer of metal gate electrode material; and
exposing said semiconductor device to a thermal treatment in an oxygen-free ambient at a temperature less than approximately 400° C.
21. The method of claim 20 , wherein forming said first layer of metal gate electrode material comprises forming a material layer comprising titanium nitride.
22. The method of claim 21 , wherein forming said first layer of metal gate electrode material further comprises forming a further material layer comprising titanium.
23. The method of claim 20 , wherein forming said second layer of metal gate electrode material comprises forming a material layer comprising titanium nitride.
24. The method of claim 20 , wherein forming said second layer of metal gate electrode material comprises forming a material layer comprising titanium, and thereafter implanting nitrogen atoms into an upper surface of said second layer of metal gate electrode material.
25. The method of claim 20 , wherein forming said gate dielectric layer comprises forming a material layer comprising hafnium oxide.
26. The method of claim 20 , wherein said gate dielectric layer is formed above said interfacial layer prior to forming source and drain regions of said PMOS transistor element in said active region.
27. The method of claim 20 , wherein said gate dielectric layer is formed above said interfacial layer after forming source and drain regions of said PMOS transistor element in said active region.