Method and device for thermocompression bonding
View Patent ↗There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
1. A method for thermocompression bonding, comprising:
preheating a resin member using an infrared radiation section; and
subjecting the resin member to thermocompression bonding using a heating section and a pressurization section such that the resin member is uniformly heated and warping of the resin member is prevented, wherein the resin member has an infrared transmittance of 80% or higher but lower than 100% except at a wavelength range where an absorption peak exists.
2. The method for thermocompression bonding according to claim 1 , wherein
in the preheating, the resin member is heated to a deflection temperature under load or lower.
3. The method for thermocompression bonding according to claim 1 , wherein
the resin member is a chip component for use to manufacture a microfluidic chip.
4. The method for thermocompression bonding according to claim 1 , wherein
in the thermocompression bonding, the resin member is heated not to reach a melting point or a glass transition point.