Patent Assignment
Reel/Frame 043211/0862
Assignment of Assignor's Interest
Recorded: 2017-07-17
Pages: 15
Assignor
SONY CORPORATION
Executed: 2016-06-20
Assignee
SONY DADC BIOSCIENCES GMBH
SONYSTRASSE 20, ANIF, 5081, AUSTRIA
Covered Properties
(2)
Method and Device for Thermocompression Bonding
Method and Device for Thermocompression Bonding
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 8, 2012
From: MUROTA, TSUKASA
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 028175/0052 →
Assignment of Assignor's Interest
Aug 1, 2014
From: MUROTA, TSUKASA
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 033448/0334 →
Assignment of Assignor's Interest
Jul 17, 2017
From: SONY DADC JAPAN INC
To: SONY CORPORATION
Reel/Frame 043211/0879 →
Change of Name
Jul 17, 2017
From: SONY DADC BIOSCIENCES GMBH
To: STRATEC CONSUMABLES GMBH
Reel/Frame 043211/0930 →