Patent Assignment
Reel/Frame 033448/0334
Assignment of Assignor's Interest
Recorded: 2014-08-01
Pages: 3
Assignor
MUROTA, TSUKASA
Executed: 2014-04-17
Assignees
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
SONY DADC CORPORATION
1-12 KITASHINAGAWA 5 CHOME, SHINAGAWA-KU, TOKYO, 141-0001, JAPAN
Covered Property
(1)
Method and Device for Thermocompression Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 17, 2017
From: SONY CORPORATION
To: SONY DADC BIOSCIENCES GMBH
Reel/Frame 043211/0862 →
Assignment of Assignor's Interest
Jul 17, 2017
From: SONY DADC JAPAN INC
To: SONY CORPORATION
Reel/Frame 043211/0879 →
Change of Name
Jul 17, 2017
From: SONY DADC BIOSCIENCES GMBH
To: STRATEC CONSUMABLES GMBH
Reel/Frame 043211/0930 →