IP Library › Assignment 043211/0879
Patent Assignment
Reel/Frame 043211/0879

Assignment of Assignor's Interest

Recorded: 2017-07-17 Pages: 2
Assignor
SONY DADC JAPAN INC
Executed: 2015-05-31
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Properties (2)
Method and Device for Thermocompression Bonding
Patent: 8,691,039 →
Application: 13/270,605 →
Publication: US 2012/0205040
Method and Device for Thermocompression Bonding
Patent: 9,956,722 →
Application: 14/245,566 →
Publication: US 2014/0216659
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2012
From: MUROTA, TSUKASA
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 028175/0052 →
Assignment of Assignor's Interest Aug 1, 2014
From: MUROTA, TSUKASA
To: SONY CORPORATION; SONY DADC CORPORATION
Reel/Frame 033448/0334 →
Assignment of Assignor's Interest Jul 17, 2017
From: SONY CORPORATION
To: SONY DADC BIOSCIENCES GMBH
Reel/Frame 043211/0862 →
Change of Name Jul 17, 2017
From: SONY DADC BIOSCIENCES GMBH
To: STRATEC CONSUMABLES GMBH
Reel/Frame 043211/0930 →