Solder bump reflow by induction heating

1. A method of applying inductive heating to join an integrated circuit chip to an electrical substrate, the method comprising:

applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, the solder bump comprising a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer, the lower portion is in electrical contact with a conductive pad, the first dielectric layer is above the conductive pad and the second dielectric layer is on top of the first dielectric layer; and

controlling a duration of application of the magnetic field to achieve a joining temperature that is approximately halfway between a storage temperature of the integrated circuit chip and an operating temperature of the integrated circuit chip.

2. The method of claim 1 , further comprising:

adjusting a thickness of the magnetic liner to enable efficient coupling with the magnetic field to achieve the joining temperature.

3. The method of claim 1 , the joining temperature approximately halfway between the storage temperature of the integrated circuit chip and the operating temperature of the integrated circuit chip being approximately 75° C.

4. The method of claim 1 , the magnetic liner having a magnetic permeability that is sufficiently high to melt the solder bump using an induction frequency equal to or lower than about 17 Mhz.

5. The method of claim 1 , the magnetic liner comprising nickel, cobalt, or iron.

6. The method of claim 1 , the magnetic liner being in direct contact with the first dielectric layer, the second dielectric layer, and the conductive pad, and the magnetic liner surrounding a perimeter surface of the upper portion and the lower portion of the solder bump separating the solder bump from the first dielectric layer, the second dielectric layer, and the conductive pad.

7. The method of claim 1 , the magnetic liner being positioned between the solder bump and the conductive pad, between the solder bump and the first dielectric layer, and between the solder bump and the second dielectric layer, and a portion of the magnetic liner being in direct contact with an upper surface of the second dielectric layer.

8. The method of claim 1 , the magnetic liner being positioned between the solder bump and the conductive pad, between the solder bump and the first dielectric layer, and not between the solder bump and the second dielectric layer.

9. The method of claim 1 , the applying of the magnetic field to the magnetic liner comprising:

applying a magnetic field to a conductive collar in thermal contact with the solder bump, the conductive collar surrounding the upper portion of the solder bump.

10. A method of applying inductive heating to join an integrated circuit chip to an electrical substrate, the method comprising:

providing the integrated circuit chip, the integrated circuit chip comprising:

a conductive pad;

a first dielectric layer above the conductive pad and having a first opening extending vertically to the conductive pad;

a second dielectric layer above the first dielectric layer and having a second opening aligned above and wider than the first opening;

a magnetic liner lining the first opening and the second opening;

a barrier layer on the magnetic liner, the barrier layer comprising a titanium layer, a titanium nitride layer, a tantalum layer, a tantalum nitride layer or a tungsten layer; and

a solder bump immediately adjacent to the barrier layer and filling the first opening, the second opening and further extending above an upper surface of the second dielectric layer, the magnetic liner being in thermal contact with a bottom and a sidewall of the solder bump through the barrier layer and the barrier layer preventing alloying of materials of the magnetic liner and the solder bump;

applying a magnetic field to the magnetic liner, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump; and

controlling a duration of application of the magnetic field to achieve a joining temperature that is approximately halfway between a storage temperature of the integrated circuit chip and an operating temperature of the integrated circuit chip.

11. The method of claim 10 , further comprising:

adjusting a thickness of the magnetic liner to enable efficient coupling with the magnetic field to achieve a desired joining temperature.

12. The method of claim 10 , the magnetic liner having a magnetic permeability that is sufficiently high to melt the solder bump using an induction frequency equal to or lower than about 17 Mhz.

13. The method of claim 10 , the magnetic liner comprising a cobalt liner.

14. The method of claim 10 , the magnetic liner comprising an iron liner.

15. The method of claim 10 , the magnetic liner further being on the upper surface of the second dielectric layer.

16. A method of applying inductive heating to join an integrated circuit chip to an electrical substrate, the method comprising:

providing the integrated circuit chip and the electrical substrate,

the integrated circuit comprising:

a conductive pad;

a first dielectric layer above the conductive pad and having a first opening extending vertically to the conductive pad;

a second dielectric layer above the first dielectric layer, thicker than the first dielectric layer, comprising a polyimide dielectric material or an organic dielectric material and having a second opening aligned above and wider than the first opening;

a magnetic liner lining the first opening and the second opening, the magnetic liner comprising a cobalt liner;

a barrier layer on the magnetic liner; and

a solder bump on the barrier layer and filling the first opening, the second opening and further extending above an upper surface of the second dielectric layer, the magnetic liner being in thermal contact with a bottom and a sidewall of the solder bump through the barrier layer and the barrier layer preventing alloying of materials of the magnetic liner and the solder bump, and

the electrical substrate comprising a bonding pad positioned immediately adjacent to the solder bump;

applying a magnetic field to the magnetic liner, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump and create a solder connection between the integrated circuit chip and the electrical substrate; and

controlling a duration of application of the magnetic field to achieve a joining temperature that is approximately halfway between a storage temperature of the integrated circuit chip and an operating temperature of the integrated circuit chip, the joining temperature that is approximately halfway between the storage temperature of the integrated circuit chip and the operating temperature of the integrated circuit chip minimizing strain on the solder bump caused by a mismatch between coefficients of thermal expansion of the integrated circuit chip and the electrical substrate during cooling to the storage temperature after the application of the magnetic field.

17. The method of claim 16 , further comprising:

adjusting a thickness of the magnetic liner to enable efficient coupling with the magnetic field to achieve the joining temperature.

18. The method of claim 16 , the magnetic liner having a magnetic permeability that is sufficiently high to melt the solder bump using an induction frequency equal to or lower than about 17 Mhz.

19. The method of claim 16 , the barrier layer comprising a titanium layer, a titanium nitride layer, a tantalum layer, a tantalum nitride layer or a tungsten layer.

20. The method of claim 16 , the joining temperature that is approximately halfway between the storage temperature of the integrated circuit chip and the operating temperature of the integrated circuit chip being approximately 75° C.