Package substrate structure for enhanced signal transmission and method
In one embodiment, an electronic package structure includes a substrate having one or more conductive plane layers formed therein. The substrate also includes a plurality of conductive pads on major surface configured to provide electrical interconnects to a next level of assembly. At least one conductive plane layer is configured to have cut-outs above the solder pads so that at least portions of the solder pad are not overlapped by the conductive plane layer.
1. A semiconductor package structure comprising:
a substrate having at least one conductive plane layer, a plurality of conductive traces on a first major surface, a plurality of solder pads on an opposing second major surface, and a plurality of conductive solder bumps coupled to the plurality of solder pads, wherein the plurality of solder pads are electrically coupled with the plurality of conductive traces by a plurality of conductive vias extending vertically from the first major surface to the second major surface, wherein at least one of the plurality of conductive solder bumps is laterally spaced apart from one of the plurality of conductive vias, and wherein the at least one conductive plane layer includes a recess overlapping all of the solder pad having at least one of the plurality of conductive solder bumps laterally spaced apart from one of the plurality of conductive vias;
a semiconductor device attached to the substrate; and
a package body covering at least the semiconductor device.
2. The structure of claim 1 , wherein:
the at least one conductive plane layer is embedded within the substrate and separated from the plurality of solder pads by a dielectric layer;
the recess comprises a at least one hole extending completely through the at least one conductive plane layer; and
at least one hole overlaps at least one solder pad.
3. The structure of claim 2 , wherein:
an edge of at least one hole is laterally spaced apart from an edge of a solder pad placed in proximity to the at least one hole; and
at least one conductive trace is configured as a single-ended interconnection.
4. The structure of claim 1 , wherein the substrate includes a second conductive plane layer that includes a second recess, wherein the second recess overlaps a solder pad and a the first recess.
5. The structure of claim 1 , wherein the plurality of conductive traces includes at least one pair of conductive traces configured as a differential pair.
6. The structure of claim 5 , wherein the differential pair and the at least one conductive plane layer are configured as micro-strip line structure.
7. The structure of claim 1 , wherein the semiconductor device is attached to the first major surface in a flip chip configuration.
8. The structure of claim 1 , wherein the at least one solder pads and the first recess have similar shapes.
9. The structure of claim 1 wherein the recess comprises at least one area of the conductive plane layer having a reduced thickness.
10. An electronic package structure comprising:
a multi-layer substrate including a first conductive plane layer embedded in the multi-layer substrate and separated from first and second major surfaces of the multi-layer substrate by dielectric material, wherein the first conductive plane layer comprises a plurality of first recesses;
a plurality of conductive traces on the first major surface;
a plurality of conductive pads on the second major surface, and a plurality of conductive solder bumps coupled to the plurality of conductive pads, wherein the plurality of conductive pads are electrically coupled with the plurality of conductive traces by a plurality of conductive vias extending vertically from the first major surface to the second major surface, wherein at least one of the plurality of conductive solder bumps is laterally spaced apart from one of the plurality of conductive vias, and wherein at least one of the plurality of first recesses completely overlaps at least one of the plurality of conductive pads having a solder bump that is laterally spaced apart from one of the plurality of conductive vias;
an electronic device coupled to the multilayer substrate; and
a protective structure covering the electronic device.
11. The structure of claim 10 , wherein each of the plurality of first recesses is laterally spaced apart from edges of each conductive pad.
12. The structure of claim 10 , wherein at least one pair of conductive traces is configured as a differential pairs.
13. The structure of claim 10 further comprising a second conductive plane layer embedded in the multi-layer substrate between the first major surface and the first conductive plane layer, wherein the second conductive plane layer includes a plurality of second recesses overlapping at least some of the plurality of conductive pads.
14. The structure of claim 10 , wherein the first plurality of recesses comprises holes extending completely through the first conductive plane layer so that no portion of the first conductive plane layer overlaps a conductive pad having a conductive solder bump that is laterally spaced apart from one of the plurality of conductive vias.
15. The structure of claim 14 , wherein each of the plurality of conductive vias extends through a hole.
16. The structure of claim 10 , wherein the plurality of first recesses comprises cavity portions.
17. A method for forming as packaged semiconductor device comprising:
providing a substrate having at least one conductive plane layer, a plurality of conductive traces on a first major surface, and a plurality of solder pads on an opposing second major surface, and a plurality of conductive solder bumps coupled to the plurality of solder pads, wherein the plurality of solder pads are electrically coupled with the plurality of conductive traces by a plurality of conductive vias extending vertically from the first major surface to the second major surface, wherein at least one of the plurality of conductive solder bumps is laterally spaced apart from one of the plurality of conductive vias, and wherein the at least one conductive plane layer includes at least a first recess overlapping all of the at least one of the plurality of conductive solder pads having a conductive solder bump that is laterally spaced apart from one of the plurality of conductive vias to reduce the capacitive effect between the conductive solder pad and the conductive plane layer;
attaching a semiconductor device to the substrate; and
forming a package body covering at least the semiconductor device.
18. The method of claim 17 , wherein providing the substrate includes providing a second conductive plane layer having a plurality of second recesses overlapping the plurality of solder pads.
19. The method of claim 17 , wherein providing the substrate includes:
providing a third conductive plane layer having a plurality of third recesses overlapping the plurality of solder pads.
20. The method of claim 17 , wherein providing the plurality of conductive traces includes providing at least one pair of conductive traces configured as a differential pair.