Semiconductor manufacturing for forming bond pads and seal rings
An integrated circuit die includes a first bond pad having a bond contact area at a first depth into a plurality of build-up layers over a semiconductor substrate of the integrated circuit die, having sidewalls that surround the bond contact area, the sidewalls extending from the first depth to a top surface of the plurality of build-up layers, and having a top portion that extends over a portion of a top surface of the plurality of build-up layers.
1. A method for making integrated circuits using a semiconductor substrate, the method comprising:
etching a first pad opening to a first depth into a plurality of build-up layers including interlayer dielectric layers and metal layers that are over the semiconductor substrate;
depositing a conductive layer over the plurality of build-up layers, including over the first pad opening and along sidewalls of the first pad opening; and
etching the conductive layer to leave a remaining portion of the conductive layer over the first pad opening, along the sidewalls of the first pad opening, and extending over a portion of a top surface of the plurality of build-up layers to form a first bond pad within the first pad opening;
wherein the first depth is located at a transition layer of the plurality of build-up layers and the transition layer comprises an isolation dielectric layer, an interconnect structure is exposed in a first sidewall of the first pad opening, and the conductive layer is conformal deposited over the first pad opening, including over the isolation dielectric layer within the first pad opening and along the sidewalls of the first pad opening, to form a connection with the interconnect structure.
2. The method of claim 1 , further comprising:
before depositing the conductive layer, depositing an isolation dielectric layer over the semiconductor substrate, including over the first pad opening and along the sidewalls of the first pad opening.
3. The method of claim 2 , further comprising:
before depositing the conductive layer, patterning the isolation dielectric layer to remove the isolation dielectric layer from over a first die contact pad on top of the plurality of build-up layers, wherein the first die contact pad is located in an area adjacent to the first pad opening.
4. The method of claim 2 , further comprising:
patterning the isolation dielectric layer to remove the isolation dielectric layer from over the top surface of the semiconductor substrate.
5. The method of claim 1 , wherein the transition layer further comprises at least one of an etch stop layer, and a second conductive layer.
6. The method of claim 1 , wherein the conductive layer is conformal deposited over the top surface of the semiconductor substrate.
7. The method of claim 1 , wherein
the semiconductor substrate comprises a first die, and
the first bond pad is located within a seal ring perimeter of the first die.
8. The method of claim 7 , wherein the etching the conductive layer further leaves a seal ring barrier around the seal ring perimeter of the first die.
9. An integrated circuit die comprising:
a first bond pad having
a bond contact area at a first depth into a plurality of build-up layers over a semiconductor substrate of the integrated circuit die,
an opening with sidewalls that surround the bond contact area, the sidewalls extending from the first depth to a top surface of the plurality of build-up layers, and
a top portion that extends over a portion of a top surface of the plurality of build-up layers,
wherein the first depth is located at a transition layer of the plurality of build-up layers and the transition layer comprises an isolation dielectric layer, an interconnect structure is exposed in a first sidewall of an opening in the plurality of build-up layers, and the first bond pad is conformal deposited over the opening in the plurality of build-up layers, including over the isolation dielectric layer within the opening in the plurality of build-up layers and along the sidewalls of the opening in the plurality of build-up layers, to form a connection with the interconnect structure.
10. The integrated circuit of claim 9 , wherein the transition layer comprises at least one of an etch stop layer, and a metal layer.
11. The integrated circuit die of claim 9 , wherein the top portion of the first bond pad further extends over a first die contact pad on top of the plurality of build-up layers.
12. The integrated circuit die of claim 9 , further comprising
a seal ring barrier surrounding the integrated circuit die, wherein the first bond pad is located within the seal ring barrier.