Epi facet height uniformity improvement for FDSOI technologies
A method of controlling the facet height of raised source/drain epi structures using multiple spacers, and the resulting device are provided. Embodiments include providing a gate structure on a SOI layer; forming a first pair of spacers on the SOI layer adjacent to and on opposite sides of the gate structure; forming a second pair of spacers on an upper surface of the first pair of spacers adjacent to and on the opposite sides of the gate structure; and forming a pair of faceted raised source/drain structures on the SOI, each of the faceted source/drain structures faceted at the upper surface of the first pair of spacers, wherein the second pair of spacers is more selective to epitaxial growth than the first pair of spacers.
1. A method comprising:
providing a gate structure on a silicon-on-insulator (SOI) layer;
forming a first pair of spacers on the SOI layer adjacent to and on opposite sides of the gate structure, wherein the first pair of spacers have upper surfaces parallel to the SOI layer and side surfaces of the first pair of spacers inclined from the upper surfaces of the first pair of spacers, such that each of the inclined side surfaces of the first pair of spacers forms an acute angle with the SOI layer and each of the inclined side surfaces of the first pair of spacers forms an obtuse angle with the upper surfaces of the first pair of spacers;
forming a second pair of spacers on the upper surface of the first pair of spacers, but not on the inclined side surfaces of the first pair of spacers, adjacent to and on the opposite sides of the gate structure, wherein upper surfaces and lower surfaces of the second pair of spacers are parallel to the upper surfaces of the first pair of spacers and the lower surfaces of the second pair of spacers contact the upper surfaces of the first pair of spacers; and
forming a pair of faceted raised source/drain structures on the SOI layer, wherein each of the faceted raised source/drain structures has a corner formed by two facets contacting an interface of the upper surface of a corresponding one of the first pair of spacers and the lower surface of a corresponding one of the second pair of spacers, and wherein portions of the pair of faceted raised source/drain structures contact the inclined side surfaces of the first pair of spacers,
wherein the second pair of spacers is more selective to epitaxial growth than the first pair of spacers.
2. The method according to claim 1 , comprising forming the lower surfaces of the first pair of spacers to a greater width than the lower surfaces of the second pair of spacers.
3. The method according to claim 2 , comprising controlling facets of the pair of faceted raised source/drain structures by a difference between a width of a lower surface of one of the first pairs of spacers and a width of a lower surface of one of the first pairs of spacers.
4. The method according to claim 1 , comprising controlling facets of the pair of faceted raised source/drain structures by a difference between a material of the first pairs of spacers and a material of the second pair of spacers.
5. The method according to claim 1 , comprising forming the first pair of spacers by depositing a furnace nitride using molecular layer deposition (MLD).
6. The method according to claim 1 , comprising forming the first pair of spacers by depositing a nitride using plasma enhanced chemical vapor deposition (PECVD).
7. The method according to claim 1 , comprising forming each of the first pair of spacers with the acute angle being between 45° and 90°, and the acute angle facing away from the gate structure.
8. The method according to claim 1 , comprising forming the second pair of spacers by depositing a furnace nitride using molecular layer deposition (MLD).
9. The method according to claim 1 , comprising forming the second pair of spacers by a low-K film.
10. The method according to claim 1 , comprising forming the pair of faceted raised source/drain structures by epitaxial growth.