Producing wafer level packaging using leadframe strip and related device

1. A method comprising:

placing dies into a mold with an active side of each die facing a surface of the mold;

placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die;

placing a mold cover over the mold and dies, wherein the etched portions of the leadframe strip are of sufficient height to contact the mold cover; and

adding mold compound in spaces between the dies and mold cover,

wherein a height of the etched portions of the leadframe strip is higher than a height of each die, and

an interface of the mold and mold cover is coplanar to a top surface of the leadframe strip on opposite side of the active side.

2. The method according to claim 1 , further comprising:

flipping the mold over 180 degrees; and

curing the mold compound,

wherein the leadframe strip comprises copper or copper coated with a protective coating.

3. The method according to claim 2 , further comprising:

removing the cured mold compound containing the dies from the mold and mold cover.

4. The method according to claim 3 , further comprising:

forming a first polymer layer on a non-active side of the dies; and

curing the polymer layer.

5. The method according to claim 4 , further comprising:

patterning the first polymer layer.

6. The method according to claim 5 , wherein the first polymer layer comprises a polyimide.

7. The method according to claim 5 , further comprising:

forming a metal layer over the patterned first polymer layer; and

patterning the metal layer.

8. The method according to claim 7 , further comprising:

forming a second polymer layer over the metal layer; and

curing the second polymer layer.

9. The method according to claim 8 , wherein the metal layer comprises copper, and the second polymer layer comprises a polyimide.

10. The method according to claim 8 , further comprising:

patterning the second polymer layer.

11. The method according to claim 10 , further comprising:

forming an under bump metallization (UBM) over the patterned second polymer layer;

flipping the dies over 180 degrees;

forming vias in the mold compound between the dies;

forming metal in the vias; and

forming and patterning a backside metal layer over the mold compound, vias and leadframe strip.

12. The method according to claim 11 , further comprising:

forming and patterning a third polymer layer over the backside metal layer;

forming ball grid array (BGA) pads over the patterned third polymer layer;

applying solder balls to the UBM;

applying solder balls to the BGA pads;

attaching a printed circuit board to the solder balls applied to the UBM; and

attaching packages to the solder balls applied to the BGA pads.

13. A method comprising:

placing dies into a mold with an active side of each die facing a surface of the mold;

placing a metal leadframe strip on the mold;

placing a mold cover over the mold and dies; and

adding polymer mold compound in spaces between the dies and mold cover,

wherein the metal leadframe strip comprises etched and half etched portions positioned between each die and the half-etched portions of the metal leadframe strip are adjacent to sides of the dies,

wherein the etched portions of the metal leadframe strip are of sufficient height to contact the mold cover,

wherein a height of the etched portions of the metal leadframe strip is higher than a height of each die, and

wherein an interface of the mold and mold cover is coplanar to a top surface of the metal leadframe strip on opposite side of the active side.

14. The method according to claim 13 , further comprising:

flipping the mold over 180 degrees;

curing the mold compound;

removing the cured mold compound containing the dies from the mold and mold cover, wherein the metal leadframe strip comprises copper or copper coated with a protective coating.