Underfill film for printed wiring assemblies
View Patent ↗A self supported underfill film ( 18 ) adhesively bonds surface mount integrated circuit packages ( 14 ) to a printed circuit board ( 10 ). The printed circuit board has conductive traces ( 12 ) and exposed conductive pads ( 13 ) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads ( 16 ) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.
1. A printed wiring assembly, comprising:
a printed circuit board, having a plurality of conductive traces on a major surface thereof;
a surface mount integrated circuit package having an array of conductive pads on a major surface thereof, said package mounted on said printed circuit board such that at least a portion of the array of conductive pads contact a corresponding portion of the conductive traces;
an underfill adhesive disposed between said package and said printed circuit board, such that the underfill adhesively bonds said package to said printed circuit board; and wherein said underfill adhesive does not extend completely around the package perimeter, and said underfill adhesive is applied as an open mesh grid free film.
2. The printed wiring assembly as described in claim 1 , wherein the underfill adhesive is softened by electromagnetic energy.
3. The printed wiring assembly as described in claim 1 , wherein a portion of the underfill adhesive extends beyond the package edge.
4. The printed wiring assembly as described in claim 1 , wherein the underfill adhesive does not contact the array of conductive pads.
5. The printed wiring assembly as described in claim 1 , wherein the underfill adhesive contains one or more additives selected from the group consisting of an inorganic filler, a dye, a pigment, and a stiffening layer.
6. The printed wiring assembly as described in claim 1 , wherein the underfill adhesive is a thermoset adhesive.
7. The printed wiring assembly as described in claim 1 , wherein the underfill adhesive is a thermoplastic adhesive.
8. The printed wiring assembly as described in claim 1 , wherein the open mesh grid free film comprises a film form having at least a first portion and two or more additional portions perpendicular to and coupled to the first portion.
9. A printed wiring assembly, comprising:
a printed circuit board, having a plurality of conductive traces on a major surface thereof;
a surface mount integrated circuit package having an array of conductive pads on a major surface thereof, said package mounted on said printed circuit board such that at least a portion of the array of conductive pads contact a corresponding portion of the conductive traces;
an underfill adhesive disposed between said package and said printed circuit board along at least a portion of a perimeter of said package major surface, to adhesively bond said package to said printed circuit board; and
wherein said underfill adhesive is applied as an open mesh grid free film, and whereas after application said underfill adhesive is softened to flow and bond said package to said printed circuit board;
wherein the underfill adhesive does not extend completely around the package perimeter.
10. The printed wiring assembly as described in claim 9 , wherein a portion of the underfill adhesive extends beyond the package edge.
11. The printed wiring assembly as described in claim 9 , wherein the underfill adhesive contains one or more additives selected from the group consisting of an inorganic filler, a dye, a pigment, and a stiffening layer.
12. The printed wiring assembly as described in claim 9 , wherein the underfill adhesive is a thermoset adhesive.
13. The printed wiring assembly as described in claim 9 , wherein the underfill adhesive is a thermoplastic adhesive.
14. A printed wiring assembly, comprising:
a printed circuit board, having a plurality of conductive traces on a major surface thereof;
a surface mount integrated circuit package having an array of conductive pads on a major surface thereof, said package mounted on said printed circuit board such that at least some of the conductive pads are soldered to at least some of the conductive traces; and
an open mesh grid free film underfill adhesive for bonding said package to said printed circuit board, wherein the underfill adhesive does not extend completely around the package perimeter.