IP Library Granted Patent US 6,870,398
Granted Patent B2
US 6,870,398 · App. 10/422,137 · Granted Mar 22, 2005

Distributed memory and logic circuits

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,870,398
App. No.
10/422,137
Granted
Mar 22, 2005
Kind
B2
Abstract

Systems and methods are disclosed for distributing memory within one or more regions of circuitry that perform logic functions (or other types of functions that require dense interconnect structures) on an integrated circuit. The distributed memory reduces high density routing congestion, allows increased logic utilization, and provides areas for additional interconnect structure. Various techniques are also disclosed for accessing the memory.

Claims (33)

1. An integrated circuit comprising:

a plurality of columns of memory;

a plurality of columns of logic circuits, wherein each of the columns of memory is disposed adjacent to one of the columns of logic circuits, with the plurality of columns of memory forming at least one block of memory having rows which extend through the plurality of columns of memory and comprises a fully interconnected memory, with each of the columns of memory partitioned into groups of memory cells; and

a decode circuit, coupled to the plurality of columns of memory, adapted to control word lines extending through the plurality of columns of memory, wherein the decode circuit is disposed in a column centrally located among the plurality of columns of memory.

2. The integrated circuit of claim 1 , wherein each of the groups of memory cells is configured as a two by four memory block, with each memory cell being a two port static random access memory.

3. The integrated circuit of claim 1 , further comprising read/write circuits, coupled to corresponding ones of the plurality of columns of memory, adapted to provide read/write capability via associated bit lines to the memory cells within the plurality of columns of memory.

4. The integrated circuit of claim 3 , wherein the read/write circuits are disposed in a row centrally located within an area occupied by the plurality of columns of memory.

5. The integrated circuit of claim 3 , wherein the read/write circuits perform a differential write via the associated bit lines and a single-ended read via one of the associated bit lines.

6. The integrated circuit of claim 3 , wherein the read/write circuits further comprise:

a first transistor, coupled to a first one of the associated bit lines; and

a second transistor, coupled to a second one of the associated bit lines, wherein the second one of the associated bit lines controls a gate voltage of the first transistor and the first one of the associated bit lines controls a gate voltage of the second transistor to equalize a rise/fall time of signal levels on the associated bit lines.

7. The integrated circuit of claim 1 , further comprising a clock row adapted to provide clock signals to the plurality of columns of memory and the plurality of columns of logic circuits.

8. The integrated circuit of claim 7 , further comprising a power supply plane disposed around the plurality of columns of memory and the plurality of columns of logic circuits.

9. The integrated circuit of claim 1 , wherein interconnect lines are disposed above and/or below the plurality of columns of memory to provide routing capability to the plurality of columns of logic circuits.

10. The integrated circuit of claim 1 , wherein the plurality of columns of memory and the plurality of columns of logic circuits are replicated within the integrated circuit to form a plurality of the blocks of memory.

11. A circuit comprising:

a plurality of columns of memory;

a plurality of columns of circuits adaptable to perform logic functions, wherein each of the columns of memory is disposed adjacent to one of the plurality of columns of circuits, with the plurality of columns of memory forming at least one block of memory having rows which extend through the plurality of columns of memory; and

means for addressing and accessing memory cells within the at least one block of memory, wherein the means for addressing and accessing the memory cells is disposed in at least one row and column centrally located among the plurality of columns of memory.

12. The circuit of claim 11 , wherein each of the columns of memory is partitioned into groups of memory cells, with each memory cell being a two port static random access memory.

13. The circuit of claim 11 , wherein the means for addressing and accessing memory cells comprises:

decode circuitry adapted to control signal levels on word lines extending through the plurality of columns of memory; and

read/write circuitry adapted to provide read and write capability via bit lines to the plurality of columns of memory cells.

14. The circuit of claim 13 , wherein the read/write circuitry performs a differential write via the bit lines and a single-ended read via one of the bit lines, with a pair of transistors coupled to the bit lines and controlled by respective ones of the bit lines to equalize a rise/fall time of signal levels on the bit lines.

15. The circuit of claim 13 , wherein the circuit is replicated to form a plurality of the blocks of memory on an integrated circuit, and further comprising interconnect lines disposed above and/or below the plurality of columns of memory to provide interconnect routing to the plurality of columns of circuits.

16. A method of increasing utilization of logic circuits on an integrated circuit, the method comprising:

arranging the logic circuits in a plurality of columns;

disposing between each of the plurality of columns of the logic circuits a column of memory to reduce local interconnect congestion;

interconnecting each of the columns of memory to form at least one block of memory whose rows extend through the columns of memory; and

disposing read/write circuitry in a row centrally located within the at least one block of memory.

17. The method of claim 16 , further comprising providing interconnect structure above and/or below the columns of memory to provide additional routing capability to the logic circuits in the plurality of columns.

18. The method of claim 17 , further comprising partitioning each of the columns of memory into groups of memory cells, with each of the memory cells being two port static random access memory.

19. The method of claim 16 , further comprising disposing decode circuitry in a column centrally located within the at least one block of memory.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
PURCHASE AGREEMENT DATED 28 FEBRUARY 2009 Recorded Sep 25, 2009
From: AMI SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 023282/0465 →
SECURITY AGREEMENT Recorded Jun 23, 2008
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; AMIS HOLDINGS, INC.; AMI SEMICONDUCTOR, INC.; AMIS FOREIGN HOLDINGS INC.; AMI ACQUISITION LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 021138/0070 →
PATENT RELEASE Recorded Mar 21, 2008
From: CREDIT SUISSE
To: AMI SEMICONDUCTOR, INC.
Reel/Frame 020679/0505 →
SECURITY INTEREST Recorded Jun 1, 2005
From: AMI SEMICONDUCTOR, INC.
To: CREDIT SUISSE (F/K/A CREDIT SUISEE FIRST BOSTON), AS COLLATERAL AGENT
Reel/Frame 016290/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2003
From: BROWN, JAMES R.; EDMONDSON, CHARLES A.; KAUFMANN, BRIAN R.
To: AMI SEMICONDUCTOR, INC.
Reel/Frame 014004/0900 →